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MacDermid Alpha Addresses Growing Demands for Electronics Reliability and Manufacturing Performance at Productronica India 2026

09/10/2026 | MacDermid Alpha
MacDermid Alpha Electronics Solutions will highlight advanced materials engineered to improve reliability, process consistency and performance in increasingly complex electronics applications at Productronica India 2026, September 16-18, at the Bangalore International Exhibition Centre in Bengaluru.

I-Connect007 Launches New Qnity Podcast Series, ‘Engineering What’s Next’

09/10/2026 | I-Connect007
I-Connect007 is pleased to announce the launch of On the Line With… Qnity: Engineering What’s Next, a new six-part podcast series exploring the materials science and engineering innovations shaping the next generation of electronics. The inaugural episode, “Inside Qnity’s Materials Science Legacy,” features Jake Joo, global technology director for Advanced Flex Technologies. In conversation with host Marcy LaRont, Joo discusses Qnity’s heritage, the evolution of its Advanced Flex Technologies business, and the history behind well-known material platforms such as Kapton® polyimide films and Pyralux® flex circuit laminates and adhesive systems.

Built Here, and Ready for What’s Next

09/08/2026 | Laura Martin, Isola
The rise of drones is no longer on the horizon. Unmanned systems have rapidly changed the modern battlefield, demonstrating the value of platforms that can sense, communicate, process information, and act at unprecedented speed. But as development and production of these systems accelerate, another mission-critical consideration is coming into focus: the supply chain behind the electronics. U.S. defense policy is focusing on reducing dependence on covered foreign sources for unmanned systems and their critical components. The message to the defense industrial base is becoming clear: Resilient, trusted supply chains matter, and the electronics inside tomorrow's unmanned platforms are part of that equation.

Connect the Dots: What PCB Designers Should Know About Materials

09/10/2026 | Matt Stevenson -- Column: Connect the Dots
What questions does your manufacturer ask when they receive a design? I can tell you one: “How will we build this?” Every PCB design has specific parameters for elements such as impedance, thermal conductivity, and SI. Designers choose material properties based on the functionality requirements of the boards they design. Does the PCB have to operate in high heat? Be flexible enough to fit into a tiny device, such as a wearable? Maintain SI without distortion or data degradation?

Beyond the Chip: Indium Highlights AI Materials Solutions at SEMICON Taiwan 2026

09/04/2026 | Indium Corporation
As artificial intelligence (AI) and high-performance computing (HPC) continue to accelerate semiconductor innovation, the industry is moving beyond the challenge of building a more powerful chip. Increasingly complex packaging, higher power density, tighter thermal requirements, and demands for faster, more cost-effective manufacturing are making system-level performance and the broader manufacturing ecosystem critical to the next generation of AI.
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