Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Dynalab Relies on Nordson YESTECH as Manufacturing Ramps Up
April 10, 2017 | Nordson YESTECHEstimated reading time: 2 minutes
Nordson YESTECH, a subsidiary of Nordson Corporation and a leading supplier of automated optical and conformal coat inspection systems for the electronics industry, has announced that Vice President Mike Pence was introduced to its YESTECH FX AOI system during his recent visit to Columbus, Ohio.
Pence spoke to a small group of invitees at Dynalab Electronic Manufacturing Services, a full-service manufacturer of circuit boards, cables and other electronics equipment.
Accompanied by fellow Republicans U.S. Sen. Rob Portman of Ohio and U.S. Rep. Pat Tiberi of Delaware County, Pence also toured the facility and met with a group of small-business owners.
During his speech, he mentioned a recent National Association of Manufacturers survey showing that optimism among manufacturers is the highest it has ever been in the survey's nearly 20-year-long history.
The EMS provider is focused on continuing to expand its capabilities in keeping with technological advances. Over the years, Dynalab has implemented several advanced manufacturing techniques to help ensure its high-quality standards. With automated test and inspection solutions from Nordson YESTECH, Dynalab inspects for solder and lead defects, component presence as well as position, correct part, polarity and through-hole parts.
Maintaining the highest quality standards has always been paramount to the success of Dynalab. Founded in 1981, Dynalab's 300 plus associates presently occupy 100,000 ft.2 in the company’s headquarters and manufacturing facility, providing engineering and manufacturing support for Fortune 500 companies.
About Nordson YESTECH
Headquartered in Carlsbad, California, Nordson YESTECH is a leading provider of automated optical inspection systems with integrated yield enhancement solutions for the printed circuit board assembly and advanced semiconductor-packaging industries, Nordson YESTECH is operated and managed by a team of industry experts with a history of success, bringing powerful and cost-effective inspection to the electronics market. The company has sales offices and customer support centers in North America, Asia and Europe. For more information on Nordson YESTECH and its products, click here.
About Nordson Corporation
Nordson Corporation engineers, manufactures and markets differentiated products and systems used for the precision dispensing and processing of adhesives, coatings, polymers and plastics, sealants, biomaterials and other materials and for fluid management, test and inspection, UV curing and plasma surface treatment, all supported by application expertise and direct global sales and service. Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing. Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in more than 30 countries. For more information, click here.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.