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IBM and Siemens Experts to Keynote Contamination, Cleaning and Coating Conference
April 11, 2017 | SMTAEstimated reading time: 1 minute
SMTA and SMART Group announce experts from IBM Corporation and Siemens AG will keynote the Contamination, Cleaning and Coating Conference. The conference is scheduled May 22-24, 2017 at the Radisson Blu Airport Hotel in Amsterdam.
On Tuesday, May 23, Prabjit Singh, Ph.D., IBM Corporation, will provide his keynote presentation on the “Occurrence and Prevention of Electronic Hardware Failures due to Gaseous and Particulate Contamination in Data Centers.” He will offer a history of electronic corrosion and survey/occurrence of corrosion in data centers worldwide. The presentation will delve into Mixed Flow Gas (MFG) and Flowers of Sulphur (FOS) testing of hardware for corrosion propensity, recent advances in FOS testing for creep corrosion, effect of humidity on creep corrosion, effect of temperature and humidity on copper and silver corrosion, as well as conformal coatings and their testing. Dr. Singh is a Senior Technical Staff Member in the Materials and Processes Department in IBM Corporation with 38 years of experience in the metallurgical engineering aspects of mainframe computer power, packaging, cooling and reliability.
Ruediger Knofe, Siemens AG, will keynote Wednesday, May 24 with his presentation titled “Cleaning of Electronics: Analysing Cleaning Results and Potential Damage Risks When Cleaning Process is Not Optimal.” The talk will highlight key objectives for cleaning of electronics including processes, cleaning agents, influencing factors, evaluation, and potential damage risks. Mr. Knofe currently works as a senior key expert engineer at Siemens AG, responsible for different material qualifications, reliability failure analyses and also cleaning processes for electronics.
This two and a half day technical event focuses on the most important and timely issues on contamination, cleaning and conformal coating in the manufacture of electronics. Conference sessions will include Residues Trapped under Component Terminations, How Problematic are Contaminants Left on Printed Circuit Assemblies, Process Control and Cleaning Material Innovations and Conformal Coating Materials and Processes.
About SMTA
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations. A Global Association Working at a Local Level.
The SMART Group Aims to Promote the Advancement of the Electronics Manufacturing Industry through the Education, Training and Notification of its Members in Surface Mount and Related Assembly Technologies, and by the Promotion of a Community of Electronics Manufacturing Professionals.
Visit the website for more information, click here.
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