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Dr. Jennie Hwang to Address PCBA Integrity and Solder Joint Reliability at SMT Hybrid Packaging
April 12, 2017 | Dr. Jennie HwangEstimated reading time: Less than a minute
Under today’s market and manufacturing environment, the effort to maximize production yield, reduce cost and assure product reliability has become increasingly important to a company’s competitiveness. On Wednesday, May 17, from 2:00 to 5:00 PM, Tutorial 6 will provide a holistic overview of product reliability and of critical “players” of the SMT assembly integrity and solder joint reliability at SMT/Hybrid/Packaging Conference in Nuremberg, Germany. Tutorial 6 emphasizes on practical working knowledge including the important roles of materials, processes and testing/service conditions, as well as the crucial principles behind the product reliability.
Dr. Jennie S. Hwang leverages on the confluence of her in-depth knowledge and comprehensive real-world experiences to address the subject. Join your industry colleagues to hear the true authority in manufacturing and reliability.
Fore registration and tutorial info, click here.
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