-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current Issue
The Legislative Outlook: Helping or Hurting?
This month, we examine the rules and laws shaping the current global business landscape and how these factors may open some doors but may also complicate business operations, making profitability more challenging.
Advancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Zero Defects International Introduces Taiyo PCB Inspection System
April 17, 2017 | Zero Defects InternationalEstimated reading time: 1 minute
Zero Defects International [ZDI] has been appointed by Taiyo Industrial Company, Japan, to manage the North American introduction of it's automated printed circuit board final inspection systems. These inspection systems have enjoyed widespread success in Europe and in Asia and are now being introduced to the United States and Canada.
Prior to beginning this assignment, ZDI contacted a range of PCB manufacturers in order to determine if there would be a perceived need for such equipment. The consensus was that the product is one that will perform a valuable function and, at the same time, provide a very acceptable ROI.
Recent initial trials in the US have shown that the machine was able to find defects that passed regular visual inspection but should have been flagged as not meeting the end customer's specification. Detection capabilities include: exposed copper, solder mask on pads, scratches, foreign material, blocked holes and chipped plating. Learn more about the TY-Vision line here.
About Taiyo Industrial Co., Ltd.
Taiyo Industrial Co., Ltd. founded in 1960, is diversified with interconnect and test business interests. Flexible printed circuits are a mainstay as well as a selection of PCB test and inspection systems.
About ZDI
ZDI, has been a leading supplier of PCB and PCBA test and inspection equipment and services for over 30 years and continues to embrace new and improved technologies within markets served domestically and internationally.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.