Nolan’s Notes: Is Mexico the Pulse of Electronics in the Americas?
Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
AIM to Participate at SMTA Wisconsin Expo & Tech Forum
April 26, 2017 | AIM SolderEstimated reading time: 2 minutes
AIM Solder is pleased to announce that it will highlight its revolutionary REL61 lead-free solder alloy, along with its full line of solder assembly materials, at the SMTA Wisconsin Expo & Tech Forum, scheduled to take place on May 2, 2017 at the Milwaukee Airport Crowne Plaza in Milwaukee. Additionally, AIM Technical Marketing Manager Timothy O’Neill will present at the technical forum.
O’Neill will present the white paper “Conformal Coating over No Clean Flux,” which addresses the complex subject of the application of conformal coating over no clean flux residue. For this study, AIM worked with OEM electronics and conformal coating manufacturers to determine the applicable test methods and the compatibility of various types of coatings and flux types. The results demonstrate possible combinations meeting the mission profile of the assembly with consideration for the assemblers’ capabilities and cost objectives.
AIM will also highlight its innovative high-reliability, lead-free solder alloys. REL61 addresses the most challenging issues with today’s common lead-free alloys, specifically BTC voiding, cost, durability and tin whiskers. It offers a low cost alternative to SAC alloys, with reliability and performance characteristics superior to SAC305 and other low/no-silver solder alloys. REL22™ is a high-reliability, high-strength lead-free solder alloy for extreme service environments, with reliability equal to Sn/Ag/Bi/Sb/Ni/Cu and a wider process window. To discover all of AIM’s products and services, visit the company at the SMTA Wisconsin Expo & Tech Forum for more information.
About Timothy O’Neill
Timothy O'Neill is the Technical Marketing Manager for AIM Solder. With nearly 25 years of experience in electronics soldering, O’Neill has co-authored several papers on PCB assembly subjects. He is a Certified IPC Specialist, a technical writer and presenter for industry trade publications and events. His commitment and dedication to sharing innovative solutions to challenging problems in the electronics assembly market have earned him recognition from the SMTA as Speaker of Distinction.
About AIM
Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training. For more information about AIM, click here.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.