Defense Speak Interpreted: If CHIPS Cuts Back, What Happens to Electronics Packaging Funds?
American Made Advocacy: Where’s the Budget for a Modern Military Run on Microelectronics?
Beyond the Board: Orbital High Ground—Why Space Superiority Is Slipping Away
MacDermid Enthone Electronics Solutions Releases Affinity ENIG 2.0
May 4, 2017 | MacDermid Enthone Electronics SolutionsEstimated reading time: 1 minute
MacDermid Enthone Electronics Solutions, a MacDermid Performance Solutions business, announces the release of the Affinity ENIG 2.0 process, a high reliability, low variation electroless nickel immersion gold plating process. Affinity ENIG 2.0 meets the stringent reliability requirements while also providing significant cost benefits to our customers.
Evolved from a combination of the best technologies of our legacy companies and developed using strict six-sigma process methodology, Affinity ENIG 2.0 is the next generation ENIG process from MacDermid Enthone Electronics Solutions. The ability of Affinity 2.0 to provide excellent solderability, uniformity, and reduced waste, including gold consumption, while adhering to all IPC finish requirements makes it a natural choice for PCB fabricators manufacturing for automotive and telecommunications OEMs. Moreover, Affinity 2.0 is able to deliver process consistency so every pad is the same.
John Swanson, Director of Final Finishes, MacDermid Enthone, noted, “The Affinity 2.0 development represents an excellent example of the combined skills and potential of our recently joined companies. Affinity 2.0 brings our customers best in class ENIG reliability, most notably through unmatched nickel corrosion performance and superior gold metal distribution. We look forward to demonstrating the cost and reliability value of Affinity to PCB fabricators, assemblers, and end users throughout this year.“
About MacDermid Enthone Electronics Solutions
MacDermid Enthone Electronics Solutions researches, formulates and delivers specialty chemistries used in the world’s leading electronics. Our products and technical support provide solutions for the most complicated, micro scale circuitry challenges. From wireless devices to automotive and military electronics – in everything you see, and in many things you don’t – MacDermid Enthone is there.
For more information, click here.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
Global Interposer Market to Surge Nearly Fivefold by 2034
09/15/2025 | I-Connect007 Editorial TeamRevenue for the global interposer market is projected to climb from $471 million in 2025 to more than $2.3 billion by 2034, according to a new report from Business Research Insights. The growth represents a CAGR of nearly 20 percent over the forecast period.
ICAPE Group Unveils Exclusive Report on Sustainability in Electronics Manufacturing
09/15/2025 | ICAPE GroupICAPE Group, a global leader in printed circuit boards (PCBs) and custom electronics manufacturing, today announces the launch of its 2025 Industry Outlook & Innovation Report: Sustainability in Electronics Manufacturing. This exclusive report is accompanied by fresh insights from a dedicated Statista survey of 100 electronics manufacturing professionals, commissioned by ICAPE Group.
Sustainability and Selective Soldering
09/15/2025 | Dr. Samuel J. McMaster, Pillarhouse InternationalSustainability is more than just a buzzword for the electronics industry; it’s a key goal for all manufacturing processes. This is more than a box-ticking exercise or simply doing a small part for environmentally friendly processes. Moving toward sustainable solutions drives innovation and operational efficiency.
Smartphone Production Rises 4% QoQ in 2Q25 as Inventory Adjustment Ends
09/12/2025 | TrendForceTrendForce’s latest investigations reveal that global smartphone production reached 300 million units in 2Q25, up 4% QoQ and 4.8% YoY, driven by seasonal demand and the recovery of brands such as Oppo and Transsion following inventory adjustments.