American Made Advocacy: Smart Policies Can Ensure AI Data Centers Are Secure
Beyond the Board: Early Engagement Means Faster Prototyping for Defense Programs
Defense Speak Interpreted: The Autonomous Plane Battle—Skyborg Vs. Loyal Wingman
I-Connect007 Launches Advanced Electronics Packaging Digest
September 15, 2025 | I-Connect007Estimated reading time: 1 minute
I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
Subscribe today to Advanced Electronics Packaging Digest and stay ahead of the curve in advanced packaging innovation.
For decades, breakthroughs in packaging, materials, and design have often been buried deep in white papers, technical reports, or behind the closed doors of standards committees. Advanced Electronics Packaging Digest was created to bring those ideas into wider circulation, ensuring that innovations in materials science, additive manufacturing, and printed metallization reach the engineers, decision-makers, and OEMs who can put them into practice.
“Our goal with Advanced Electronics Packaging Digest is to highlight the interconnect, one of the most important and continuously evolving areas of technology in electronics manufacturing, and showcase the companies driving innovation in materials, additive manufacturing, and printed metallization,” said Marcy LaRont, Executive Director of I-Connect007.
The inaugural issue features:
- Expert commentary from industry leaders addressing packaging challenges and opportunities.
- The Global Electronics Association’s latest white paper on advanced packaging.
- An interview with Matt Kelly, CTO of the Global Electronics Association, on the urgency of system-level integration in advanced packaging.
Kelly emphasized the importance of making this knowledge more widely available: “If we don’t force the system-level integration of these technologies, then the industry will find out in a few years that some of this stuff doesn’t work as well as it should.”
By transforming specialized research into accessible, industry-wide insight, AEPD aims to accelerate innovation and strengthen collaboration across the electronics manufacturing ecosystem.
AEPD is designed for PCB and system designers, engineering decision-makers, OEMs, and business leaders looking for actionable intelligence to guide their technology roadmaps.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Henger Microelectronics Expands Global Footprint with Major Equipment Shipment to Southeast Asia
10/31/2025 |Henger Microelectronics has reached a major milestone in its global expansion strategy with the successful shipment of advanced plasma etching and cleaning systems, along with automation equipment, to multiple countries and regions across Southeast Asia. This achievement marks a significant step forward in the company’s international growth and reinforces its position as a leading force in the global plasma equipment industry.
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology
10/31/2025 | PRNewswireCephia, a startup building products using advanced AI computational imaging technologies and silicon sensors made from advanced metamaterials, formally launched with several pilot customers and $4 million in seed venture capital funding.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
NEDME 2025 Draws Strong Northwest Crowd, Builds on Tradition of Regional Collaboration
10/31/2025 | NEDMEThe NW Electronics Design & Manufacturing Expo (NEDME) 2025 once again brought together the Pacific Northwest community for a full day of learning, networking, and industry connections.