-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
European PCB Designer Day to Focus on Critical Layout Factors
May 5, 2017 | EIPCEstimated reading time: Less than a minute
The European Institute of Printed Circuits (EIPC) and FED will be holding European PCB Designer Day at the Marivaux Hotel Congress & Seminar Center in Brussels, Belgium on June 21, 2017.
Design decisions have life-long project consequences, not just for technical performance but with the choices made by the designer at the outset often determining project success or failure.
Designer Day focuses on some of the more critical design factors including base material selection, performance modelling and testing, signal integrity, component layout tools and 3D structures, and embedded components.
The program is aimed at members of the PCB design community who wish to enhance their skills with a day of presentations by leading industry figures.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Setting Design Constraints Effectively
07/31/2025 | Stephen V. Chavez, Siemens EDAPCB design requires controlling energy within the medium of a PCB. The manner in which we control the chaos of energy is by implementing and utilizing physical and electrical rules, known as constraints, along with a specific structure and material(s) that make up what is known as the foundation of the design. These rules govern everything within the PCB structure and generally fall into two camps: performance and manufacturability. Setting this foundation correctly is extremely important and the key to success.
MacDermid Alpha Electronics Solutions Unveils Unified Global Website to Deepen Customer, Talent, and Stakeholder Engagement
07/31/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronics Solutions, the electronics business of Elements Solutions Inc, today launched macdermidalpha.com - a unified global website built to deepen digital engagement. The launch marks a significant milestone in the business’ ongoing commitment to delivering more meaningful, interactive, and impactful experiences for its customers, talent, and stakeholders worldwide.
Ansys 2025 R2 Enables Next-Level Productivity by Leveraging AI, Smart Automation, and Broader On-Demand Capabilities
07/30/2025 | PRNewswireAnsys, now part of Synopsys, announced 2025 R2, featuring new AI-powered capabilities across the portfolio that accelerate simulation and expand accessibility.
Connect the Dots: Sequential Lamination in HDI PCB Manufacturing
07/31/2025 | Matt Stevenson -- Column: Connect the DotsAs HDI technology becomes mainstream in high-speed and miniaturized electronics, understanding the PCB manufacturing process can help PCB design engineers create successful, cost-effective designs using advanced technologies. Designs that incorporate blind and buried vias, boards with space constraints, sensitive signal integrity requirements, or internal heat dissipation concerns are often candidates for HDI technology and usually require sequential lamination to satisfy the requirements.
Target Condition: The 5 Ws of PCB Design Constraints
07/29/2025 | Kelly Dack -- Column: Target ConditionHave you ever sat down to define PCB design constraints and found yourself staring at a settings window with more checkboxes than a tax form? You’re not alone. For many designers—especially those newer to the layout world—the task of setting up design constraints can feel like trying to write a novel in a language you just started learning.