The Government Circuit: From Tax Policy to Tariffs, Denver to Delhi, Speaking Up for Electronics 
Global Sourcing Spotlight: Evaluating a Supplier’s Capabilities
Global Citizenship: Cultivating Cross-border Partnerships With Integrity
The Benefits of Applying Flux Directly to a Micro BGA
May 12, 2017 | Richard Barratt, JJS ManufacturingEstimated reading time: 5 minutes
Left image: Horizontal section showing a slice through the center of the BGA. You can also see the copper pad of the PCB, BGA ball and connection between both. Right image: Vertical section removing the device to leave just the solder balls.
Our conclusions
Applying flux directly to micro BGAs is a good alternative to stencil printing but comes at a cost. Depending on the manufacturer a dip unit and transfer plate can cost anywhere between £13,000–£17,000, compared to a stepped stencil that typically costs just a few hundred pounds. Much depends on the products you are manufacturing and the quantities you intend to produce on a monthly basis. If the volumes are high enough then investment in an automated solution may well be the right decision for you. If, however, you are producing small batch quantities then you may not be able to justify the investment and need to continue trials with different stencil designs and materials.
Hopefully, this blog post has provided a useful insight into just one of the challenges electronics manufacturers face on a daily basis. Although the majority of issues can be overcome through robust engineering and NPI processes, the most effective way to mitigate them is to ensure design and manufacturing teams work closer from the outset.
So, if you're forced to make component changes in the future, we recommend you look at the rest of the board and then talk to your manufacturing partner before committing to materials to ensure your design can be manufactured in a cost-effective manner.
This article originally appeared on the JJS Manufacturing blog, which can be found here.
Page 2 of 2Share on:
Suggested Items
SolderKing’s Successful Approach to Modern Soldering Needs
06/18/2025 | Nolan Johnson, I-Connect007Chris Ward, co-founder of the family-owned SolderKing, discusses his company's rapid growth and recent recognition with the King’s Award for Enterprise. Chris shares how SolderKing has achieved these award-winning levels of service in such a short timeframe. Their secret? Being flexible in a changing market, technical prowess, and strong customer support.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
Breaking Silos with Intelligence: Connectivity of Component-level Data Across the SMT Line
06/09/2025 | Dr. Eyal Weiss, CybordAs the complexity and demands of electronics manufacturing continue to rise, the smart factory is no longer a distant vision; it has become a necessity. While machine connectivity and line-level data integration have gained traction in recent years, one of the most overlooked opportunities lies in the component itself. Specifically, in the data captured just milliseconds before a component is placed onto the PCB, which often goes unexamined and is permanently lost once reflow begins.
BEST Inc. Introduces StikNPeel Rework Stencil for Fast, Simple and Reliable Solder Paste Printing
06/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and products is pleased to introduce StikNPeel™ rework stencils. This innovative product is designed for printing solder paste for placement of gull wing devices such as quad flat packs (QFPs) or bottom terminated components.
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.