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IPC to Host Fourth Annual Reliability Forum in Germany
May 16, 2017 | IPCEstimated reading time: 1 minute
IPC will host Reliability Forum: Emerging Technologies from June 27-28 in Düsseldorf, Germany. This two-day event will address building reliability into electronic products utilizing newer technologies and processes in every phase of the product launch cycle.
The forum will include a tutorial from Plexus on Design for Excellence that will provide best practices in design, assembly, and problem analysis. In addition, speakers from around the globe including representatives from leading industry organizations such as Robert Bosch GmbH, Airbus, Safran and NPL will address important topics ranging from automotive requirements in electronics to PCB failure analysis to EMI shielding to whiskering research, and more.
"The IPC Reliability Forum is the premier place to discuss and learn about the newest innovations in the manufacturing of high reliability products," said Sanjay Huprikar, vice president of member success at IPC. "In addition to technical experts sharing their latest breakthroughs in materials and manufacturing processes, I am also excited that the Forum will showcase the potential impact of printed electronics and Industry 4.0 on reliability. Our members tend to be passionate about events that uniquely blend technical content, forward-looking discussions and networking with their peers.”
For more information or to register for Reliability Forum: Emerging Technologies, click here.
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