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Current IssueIn Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
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EIPC SpeedNews: News From the European PCB Industry
May 22, 2017 | EIPCEstimated reading time: Less than a minute

- 2nd EIPC Workshop on PCB Bio MEMs, May 31
- EIPC Summer Conference Birmingham, June 1–2
- European PCB Designer Day, FED & EIPC, Brussels, June 21
- SMT Hybrid Packaging 2017 Remains Leading Platform of Electronic Manufacturing
- SCHWEIZER Presents Innovation at PCIM 2017
- Desperately Short of Labor, Mid-sized Japanese Firms Plan to Buy Robots
- Polar News May
- Aegis' FactoryLogix Brings Smart Factory Benefits for Qualitel
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Breaking Silos with Intelligence: Connectivity of Component-level Data Across the SMT Line
06/09/2025 | Dr. Eyal Weiss, CybordAs the complexity and demands of electronics manufacturing continue to rise, the smart factory is no longer a distant vision; it has become a necessity. While machine connectivity and line-level data integration have gained traction in recent years, one of the most overlooked opportunities lies in the component itself. Specifically, in the data captured just milliseconds before a component is placed onto the PCB, which often goes unexamined and is permanently lost once reflow begins.
Top Tech in Taiwan: IPC's Blueprint to Advance Smart Manufacturing
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IDC Decreases its Worldwide Smartphone Forecast to 0.6% for 2025 Amidst Uncertainty and Tariff Volatility
06/03/2025 | IDCWorldwide smartphone shipments are forecast to grow 0.6% year-over-year (YoY) in 2025 to 1.24 billion units, according to the International Data Corporation (IDC) Worldwide Quarterly Mobile Phone Tracker.