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Goepel Inline X-ray System Offers Shorter Cycle Times and Faster PCB Handling
May 24, 2017 | GOEPEL ElectronicEstimated reading time: Less than a minute
Goepel electronic has launched the latest version of its X Line · 3D in-line X-ray system, which features improvements in hardware and software functions to ensure even higher test speeds and shorter cycle times.
The X Line · 3D Series 300 offers improved PCB transfer, significantly reducing PCB assembly handling time. In addition, systems of the speed variant X40PLUS are now capable of scanning speeds of up to 510 mm/s during image acquisition. Also, the Series 300 has a new soft-stop option that can be used to stop circuit boards and ceramic substrates in seconds, thereby avoiding the risk of damage as with mechanical "hard stops".
On the software side, the new version of PILOT AXI 3.3, which is now available for the X Line · 3D, features advanced test functions that capture air inclusions (voids) and solder balls even more reliably. In addition, it has new filter options that provide additional image optimization.
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Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.