-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Vapor Degreasing Chemistries to Remove Difficult Lead-Free and No-Clean Fluxes from PCBs
May 26, 2017 | Venesia Hurtubise, Elizabeth Norwood, Wells Cunningham, and Laura LaPlante, MicroCare Corp.Estimated reading time: 7 minutes
Cost of Ownership
Although cleaning is crucial to many electronics industries, it is still only one aspect of the total manufacturing process, and so the cost of cleaning needs to remain reasonable to the overall manufacturing cost. Fortunately, the cost-per-cleaning for the vapor degreasing process is considerably low and can be comparable or less than that of aqueous cleaning. When comparing solvent vapor degreasing to aqueous cleaning systems, there are many factors to consider including capital investment, equipment footprint, power supply, cleaning time, detergent/solvent supply, and waste disposal. In other words, a vapor degreaser and an aqueous machine capable of cleaning the same number of parts-per cycle will have different overall costs, thus different costs-per-part cleaned. Aqueous systems typically have larger working footprints, power requirements, and longer cleaning cycles; these are due to the need for several washing and rinsing stations, high temperature inputs, and reliance on mechanical spraying and washing mechanisms4. Although vapor degreasers require less time and overall maintenance, the cleaning solvents are typically more expensive than aqueous detergents; however, properly maintained equipment should retain solvent, and the distillation process keeps solvent pure for continuous use.
To read the full version of this article, which appeared in the April 2017 issue of SMT Magazine, click here.
Page 3 of 3Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.