Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Promex to Showcase Heterogenous Assembly Services for Complex Devices at ECTC
May 26, 2017 | Promex Industries Inc.Estimated reading time: 1 minute
Promex Industries Inc. will showcase its heterogenous assembly services for complex medical and biotech devices, and its Quik-Pak Division will exhibit Open-molded Plastic Packages (OmPP) and air cavity QFN (Quad Flat No-Lead) Packages in Booth 215 at The Electronic Components and Technology Conference (ECTC) in Lake Buena Vista, Florida, on May 30 to June 2, 2017.
Promex's Silicon Valley facility features a seamless transition from engineering to production using data-driven, documentation-oriented processes. The company integrates RoHS-optimized SMT with semiconductor microelectronic packaging and assembly. In-house wafer thinning, dicing, wirebond, flip chip and overmolding services are supported by an engineering team with more than 35 years of experience. Fully controlled process flows ensure high reliability manufacturing. Promex offers Class 100 and 1000 clean rooms, is ITAR registered and ISO 13485:2003 and ISO 9001:2008 certified.
Quik-Pak's OmPPs and air cavity QFNs are available in off-the-shelf and custom configurations for prototype, mid volume and production volume requirements. OmPPs feature gold plating for wire bondability and thermal regulation, RoHS- and REACH-compliant green molding compound, short, highly conductive interconnects and JEDEC outlines with matching ceramic, plastic and glass lids. Quik-Pak also offers complete assembly services to help accelerate time to market, including flip chip and wire bonding (Au, AI and Cu from 0.6-20 mil diameters), wafer thinning, dicing, and pick and place.
ECTC is sponsored by the Components, Packaging and Manufacturing Technology (CPMT) Society of the IEEE. This international event brings together the best in packaging, components and microelectronic systems science, technology and education. It will feature advanced packaging, modeling and simulation, optoelectronics, interconnections, materials and processing, applied reliability, assembly and manufacturing technology, components and RF and emerging technologies.
Share on:
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/09/2025 | Andy Shaughnessy, Design007 MagazineTrade show season is wrapping up as we head into summer. Where has the time gone? I hope you all get the chance to take a vacation this year, because I know you’ve earned one. Speaking of which, when was my last vacay? If I can’t remember, it’s probably time for one. It’s been a busy week in electronics, with fallout from the back-and-forth on tariffs taking up most of the oxygen in the room. We have quite an assortment of articles and columns for you in this installment of Must-Reads. See you next time.
Kaynes Technology Acquires Canada-Based August Electronics
05/09/2025 | PRNewswireAugust Electronics Inc. is pleased to announce that it has entered into a definitive agreement to be acquired by Kaynes Canada Limited, a wholly owned step-down subsidiary of Kaynes Technology India Limited, a leading Electronics System Design & Manufacturing (ESDM) company. The transaction is expected to close by the end of May 2025, subject to customary regulatory approvals and closing conditions.
Localized Automation Becomes a Tariff Storm Safe Haven, but U.S. Smart Factory Build-Out Costs Far Exceed China’s
05/09/2025 | TrendForceTrendForce’s latest “Human-Machine Technology Report” points out that although the 90-day delay on the U.S. reciprocal tariffs announced by the Trump administration in early April 2025 offers temporary relief, it has already triggered lasting shifts in global manufacturing and supply chain strategies.
Primech AI Plans Production of 300 HYTRON Robots through its China Manufacturing Expansion
05/09/2025 | Globe NewswirePrimech AI Pte. Ltd., a subsidiary of Primech Holdings Limited announced a significant expansion of its manufacturing capabilities through a strategic manufacturing partnership in Guangdong Province, China.
Ultrahuman Expands its American Factory’s Manufacturing Capacity
05/09/2025 | GlobeNewswireUltrahuman, a pioneer in health optimization technology, has announced that it’s ramping up its capacity of the Ring AIR. Ultrahuman’s manufacturing facility (UltraFactory) in partnership with SVtronics, a US-based electronics manufacturing business, has been operational in Plano, Texas, since November 2024.