Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
Nolan’s Notes: Everyone Has Their Eye on India
Koh Young Technology to Launch Latest 3D AOI Systems at JPCA 2017
May 29, 2017 | Koh Young TechnologyEstimated reading time: 1 minute
Koh Young Technology Inc. will showcase its latest innovations including its full 3D AOI with the new theme 'True 3D now powered by Intelligent Platform' in Booth 4E-24 at the upcoming JPCA Show 2017, which is scheduled to take place June 7–9, 2017 in Tokyo, Japan.
Koh Young, recognized as a leader in AOI technology, will debut its new 3D AOI system, which measures the true profilometric shape of components, solder joints, patterns on assembled PCB with patented 3D measurement. This innovative AOI system will be configured with 12 Mega Pixel Side-View Cameras in addition to the 12 Mega Pixel Top-Down Camera, offering height measurement of components up to 25mm in height.
Koh Young will also display its world-best performance 3D SPI system – aSPIre 3. From true 3D Foreign Material Inspection to Auto-verification features, Koh Young's 3D SPI system has established a remarkable reputation for industry-leading measurement accuracy and inspection reliability.
The KSMART software solution connects inspection results from Koh Young's 3D SPI systems and 3D AOI systems so that the defect root cause can be traced, analyzed, and removed as early as possible in the process. Key features include Link@KSMART; SPC@KSMART; and Library Manager; with additional options such as RTM (Real Time Monitoring) and RMS (Remote Monitoring System).
About Koh Young Technology Inc.
Koh Young Technology, a leading provider of Solder Paste Inspection (SPI) and Automated Optical Inspection (AOI) systems, specializes in the design and manufacturing of 3D measurement and inspection equipment for the global circuit board assembly and semiconductor markets. Direct sales and support centers are in the United States, Germany, Japan, Singapore, China and Korea. For more information about the company, click here.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Koh Young, Fuji, and Kurtz ERSA Drive Smart Manufacturing Solutions for EV and Automotive Electronics at Kunshan, China Technical Seminar
09/11/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, partnered with Fuji Corporation and Kurtz ERSA to host an exclusive technical seminar for leading automotive manufacturers in East China. Held on September 4 at Fuji’s factory in Kunshan, the event gathered participants representing over 35 companies.
MacDermid Alpha Presents at SMTA New Delhi, Bangalore Chapter, on Flux–OSP Interaction
09/09/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha contributes technical insights on OSP solderability at the Bangalore Chapter, SMTA reinforcing commitment to knowledge-sharing and industry collaboration.
Electra’s ElectraJet EMJ110 Inkjet Soldermask Now in Black & Blue at Sunrise Electronics
09/08/2025 | Electra Polymers LtdFollowing the successful deployment of Electra’s Green EMJ110 Inkjet Soldermask on KLA’s Orbotech Neos™ platform at Sunrise Electronics in Elk Grove Village, Illinois, production has now moved beyond green.
Absolute EMS: The Science of the Perfect Solder Joint
09/05/2025 | Absolute EMS, Inc.Absolute EMS, Inc., a six-time award-winning provider of fast turnaround, turnkey contract electronic manufacturing services (EMS), is drawing attention to the critical role of 3D Solder Paste Inspection (SPI) in ensuring the reliability of both FLEX and rigid printed circuit board assemblies (PCBAs).
Indium Corporation to Highlight High-Reliability Solder Solutions at SMTA Guadalajara Expo
09/04/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, will feature a range of innovative, high-reliability solder products for printed circuit board assembly (PCBA) at the SMTA Guadalajara Expo and Tech Forum, to be held September 17-18 in Guadalajara, Mexico.