Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

AT&S Advances Glass Core Substrates for AI, HPC, and Photonics

04/22/2026 | AT&S
AT&S is advancing glass core substrates from research toward industrial use in artificial intelligence, high-performance computing, high-speed communications and photonics.

IBM, UIUC Expand Discovery Accelerator for AI and Quantum Computing

04/20/2026 | PRNewswire
IBM and the Grainger College of Engineering at the University of Illinois Urbana-Champaign (U. of I.) announced an expansion of the IBM-Illinois Discovery Accelerator Institute.

Long Night of Research 2026: AT&S Brings Artificial Intelligence to Life

04/15/2026 | AT&S
When the Long Night of Research takes place throughout Austria on Friday, April 24, setting an example for the country’s innovative strength, AT&S will be there with a special highlight.

Foxconn Recognized as Top 100 Global Innovators 2026

04/14/2026 | Foxconn
Hon Hai Technology Group (Foxconn) has been named in Clarivate’s Top 100 Global Innovators 2026, a milestone for the ninth year running and as the accelerating role of artificial intelligence stood out in innovation activity among peers in the prestigious ranking.

Carbice Awarded Multi-Million Dollar U.S. Navy Contract for Thermal Assembly Joint Technology

04/14/2026 | PRNewswire
Carbice, a U.S.-based manufacturer and supplier of novel multifunctional assembly joint technologies, has been awarded a multi-million dollar contract by the U.S. Navy's Office of Naval Research.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in