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I-Connect007 Editor’s Choice: Five Must-Reads for the Week

06/06/2025 | Nolan Johnson, I-Connect007
Maybe you’ve noticed that I’ve been taking to social media lately to about my five must-reads of the week. It’s just another way we’re sharing our curated content with you. I pay special attention to what’s happening in our industry, and I can help you know what’s most important to read about each week. Follow me (and I-Connect007) on LinkedIn to see these and other updates.

MKS’ Atotech, ESI Showcase Next-gen PCB and Advanced Packaging Solutions at JPCA 2025

06/04/2025 | MKS’ Atotech
MKS, through its leading surface finishing brand Atotech® and laser system brand ESI®, proudly announces its participation at the 2025 JPCA Show in Tokyo, Japan, from June 4–6. At booth 6D-01, the company will highlight the combined power of its strategic brands Atotech® and ESI®, showcasing the latest innovations in advanced packaging, package substrate, and printed circuit board (PCB) manufacturing.

NCAB Closes Acquisition of B&B Leiterplattenservice GmbH in Germany

06/04/2025 | NCAB
As was communicated on April 23 NCAB has signed an agreement to acquire 100 percent of B&B Leiterplattenservice GmbH (B&B) headquartered in Mittweida, Germany. Today, the 3 of June the acquisition is closed, and the company now is part of the NCAB Group.

DuPont Powers AI, Next-Gen Electronics with Advanced Interconnect Innovations at JPCA Show 2025

06/04/2025 | PRNewswire
DuPont announced its participation in the Total Solution Exhibition for Electronic Equipment 2025 (JPCA Show 2025), taking place from June 4-6 at the Tokyo Big Sight East Exhibition Halls. At Booth #6C-03,

Advint Delivers Advanced Electroplating Training to Triangle Labs 

06/02/2025 | Advint Incorporated
During the last week of April, Advint Incorporated conducted a comprehensive two-day on-site electroplating training session for the technical team at Triangle Labs, Inc., a key innovator in the printed circuit board space. The training was structured to align with the demands of high-reliability plating processes suitable for RF and high-frequency substrates.
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