-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
SMTA International Conference Program Finalized and Registration Now Open
June 7, 2017 | SMTAEstimated reading time: 2 minutes
The Surface Mount Technology Association (SMTA) has announced that the program for the SMTA International Conference and Exhibition is finalized and available on-line at www.smta.org/smtai and that registration is open. Taking place September 17-21, 2017 at the Donald Stephens Convention Center in Rosemont, Illinois, the conference features 20 workshops, 130 technical papers, and numerous complimentary offerings for engineers and professionals in the electronics manufacturing industry.
Technical tracks will cover Advanced Packaging Technology; Manufacturing Excellence - process and assembly; Substrates/PCB Technology; Flux, Solder and Adhesives; and Inspection Technologies. Engineers from major manufacturing companies like Celestica, Flex, IBM, Intel, Lockheed Martin, Sanmina Corporation, and several universities will present their latest research on critical process improvements, new materials and technologies. One session on Monday afternoon comprised of all women presenters will be followed by a panel discussion on the technical achievements of women, mentoring, and STEM initiatives. Three focused symposia rounding out the technical conference are the Technical Innovations Symposium, Harsh Environments Symposium, and Lead-Free Soldering Technology Symposium.
Twenty half-day educational workshops are offered Sunday and Monday from expert instructors on topics including Fan-Out Wafer-Level Packaging and 3D Packaging, DfX, Cleaning, Ball Grid Array (BGA) issues, Flex Circuits, Reliability, Inspection, Temperature Profiling, Reflow Soldering, Stencil Printing, Surface Finishes, Process Troubleshooting and more.
Microsoft’s General Manager of their HoloLens Hardware Design Team, Rune Jensen, will keynote the conference with a presentation Tuesday morning titled “Experiencing Mixed Reality - using the Microsoft HoloLens.” The ability to project 3D images into a user’s field of view has many exciting applications in the industrial space with the ability to provide real-time information or images fixed in-space to a real-world object. Microsoft calls this “mixed reality.” Rune will share technical challenges and triumphs as well as illustrate several practical applications of this innovative technology.
Over 170 exhibiting companies will display equipment, materials, and services at the Electronics Manufacturing Exhibition, which will be held Tuesday and Wednesday, September 19 - 20. Attendees are invited to join Tech Tours to get an inside look at the latest in equipment and technology available. Lunch coupons will be provided both days on the show floor.
IPC Fall Standards Development Committee Meetings are co-located with the conference. The full schedule for IPC committee meetings are on the IPC website. Registration is required.
Several events at SMTA International are free to all attendees including Spotlight Sessions with presentations on Component Challenges, Reliability, Solder Alloys, Soldering, Process Control, RoHS and Traceability. Other complimentary events available to all attendees are the Women’s Leadership Program, New Product Showcase, Fun Run, Appreciation Reception, Tech Tours, and the Students and Young Professionals Night Out.
The 10th Annual SMTA International Golf Tournament will kick-off with a shotgun start at 8:30am on Thursday, September 21. Over 60 golfers are expected to participate in the tournament at the Maple Meadows Golf Club.
The early registration deadline is August 25, 2017. For full details and to register for SMTA International, visit http://www.smta.org/smtai or contact SMTA Executive Director Tanya Martin: 952-920-7682 or tanya@smta.org.
SMTA - A Global Association Working at a Local Level
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.