Global Sourcing Spotlight: How Global Sourcing Drives Innovation
One World, One Industry: IPC APEX EXPO 2025 Marks a Special Anniversary Year
Nolan’s Notes: Your Golden Ticket
IPC Hand Soldering Competition Winner Crowned at SMT Hybrid Packaging 2017
June 8, 2017 | IPCEstimated reading time: 1 minute
The competition was fierce as 34 competitors participated in the IPC’s Hand Soldering Competition at SMT Hybrid Packaging 2017 in Nuremberg, Germany. Taking first place and a cash prize of €300 was Elaine Chesnais, Thales International, who earned 433 points out of a possible 437. Chesnais was the second-place winner at SMT in 2016.
Second place and a cash prize of €200 this year went to Aurelie Buret, Thales International. Ekatarina Stahlmann, Grundig Business Systems, took third place and a cash prize of €100. Ekatarina Stahlman is not new to the IPC Hand Soldering Competition at SMT Hybrid Packaging Exhibition as she was the first-place winner in 2015 and 2016.
Participants in the hand soldering competition were tasked with building a functional electronics assembly, a new design this year, within a 60-minute time limit. Master Instructor Trainers Rob and Stefan Walls, PIEK, and Hubert Huffschmitt, IFTEC, served as independent judges and evaluated each assembly based on workmanship, overall functionality, compliance with IPC-A-610 Class 3 criteria and speed to complete the PCB.
"The best-of-the-best hand soldering talent in Europe came to compete at this event," said David Bergman, IPC vice president of international relations. "The competition was tough, but each competitor rose to the challenge. We look forward to hosting more hand soldering competition across the globe."
Bergman added, "IPC would like to thank hand soldering competition gold sponsors: JBC, Kurtz Ersa, and Weller; silver sponsors: Almit, Balver Zinn, and NCAB Group; bronze sponsor: Piek; IFTEC and ULT and contest contributors: Mircosolder for their support."
IPC is planning to hold additional hand soldering competitions in Europe, later this year in October and November. Watch for announcements from IPC with locations and times.
Share on:
Suggested Items
IPC Hall of Fame Spotlight Series: Highlighting Denny Fritz
03/13/2025 | Dan Feinberg, I-Connect007This month, the Hall of Fame spotlight features Denny Fritz, a long-time friend and associate of mine. Denny first got involved with IPC in 1978 while working with MacDermid. His first efforts were with the various board fabrication committees, something he believes helped lead to his eventual Hall of Fame award.
Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI
03/12/2025 | Ventec International GroupVentec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.
IPC Releases Latest List of Standards and Revisions
03/12/2025 | IPCEach quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q1 2025.
The Test Connection Inc. Promotes Melanie Rutkauskas to Director of Operations for The Training Connection, LLC
03/11/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is pleased to announce the promotion of Melanie Rutkauskas to Director of Operations for The Training Connection, LLC (TTC-LLC). With her extensive background in operations management, accounting, and customer relations, Melanie brings a wealth of experience and leadership to her new role.
Hannah Nelson: The Inspiring Journey of an Emerging Engineer
03/11/2025 | I-Connect007 Editorial TeamAt last year’s IPC APEX EXPO, former IPC Emerging Engineer Hannah Nelson had the opportunity to reflect on her inspiring journey into the world of engineering, from her education at Valparaiso University to her internship and her first job at Texas Instruments. From pivotal moments and the unexpected turns that helped shape her early career and passion for electrical engineering, her story highlights the importance of interdisciplinary collaboration, taking opportunities that arise early on, finding confidence in one's voice, and the rewards of pursuing one's passions within the engineering field.