-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueIn Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Printed Circuit Broker Elmatica Encourage Development of New Language
June 28, 2017 | ElmaticaEstimated reading time: 2 minutes
Elmatica is currently taking charge in developing a new language for PCB fabrication data. The development of the language will be by an independent international task group with members from the entire supply chain. If the industry is up for the challenge, the result can be both cost-efficient and a vital time saver in production.
"We are currently creating an open standard for communicating information needed for PCB fabrication. This standard is a PCB language to share information accurately. It can be used to interchange information on the specification, a profile and capabilities. Development and maintenance of the standard will be by an international task group. The task group will be committed to a continuous development and scheduled updates," says CTO Andreas Lydersen.
Avoid being a lost tourist
In today's situation, a substantial amount of time is used to interpret all information needed in the fabrication process. With a common language, the industry would save both time, money and avoid mistakes caused by misinterpretations.
"If you take as an example, legend, there are multiple ways to describe this. Some say 'legend,' 'silk screen,' 'silkscreen,' 'ink' or 'ident.' It's not rocket science to understand that interpreting this take up too much time in the supply chain. The immediate gain with the new language will be that we do not need the gerber file to set price and delivery," said Lydersen. "Imagine being a tourist at an unfamiliar destination, you are able to communicate at a basic level with body language and interpretations, but as soon as things gets complicated you need to bring along an interpreter to your vacation. If everyone used the same language, this would be unnecessary. The same goes for PCB fabrication. Why waste money on interpretations, when the issue can be easily fixed?"
"This language opens up for automation on a completely different level, and has the potential to be the most important progress in the PCB industry, since the Gerber file arrived," Lydersen added.
Participants Wanted
Elmatica needs participants to help develop this PCB specification standard, or language, called "Circuit Data." The data will have XML output and could easily be implemented into your system. It is not an alternative to ODB++, Gerber or IPC-2581 but can be a valuable integrated part of these files.
"Everything is based on IPC T-50 terminology, the task group had their first webinar this week, and more members are needed. This is not a Elmatica tool, but an open standard free for all to use, and the beta version is already set. We are aiming for a common understanding of a beta version, this side of the summer and encourage people in the industry to take part and develop this standard," said Lydersen.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/13/2025 | Marcy LaRont, I-Connect007Today is Friday the 13th, and in much of Western folklore, this is a day when bad luck is lurking. But while Friday the 13th may top Western superstition charts, the global calendar is sprinkled with its own unlucky legends. In Spain and Greece, the bad juju lands on Tuesday the 13th—a day linked to Mars, the god of war, and naturally, chaos. In Italy, it’s Friday the 17th that is feared, thanks to the Roman numeral XVII, which can be rearranged to spell VIXI—Latin for “I have lived” (a poetic way of saying you’re dead).
Priority Software Appoints Ben Karniel as Chief Revenue Officer to Spearhead Global Growth
06/12/2025 | Priority SoftwarePriority Software, a leading provider of scalable and agile cloud-based business management solutions, proudly announces the appointment of Ben Karniel as its new Chief Revenue Officer (CRO), effective May 1, 2025. This strategic addition to the executive team underscores Priority's commitment to expand its global footprint.
Roll-to-Roll Technologies for Flexible Devices Set to Grow at 11.5% CAGR
06/11/2025 | GlobeNewswireAccording to the latest study from BCC Research, the “Global Markets for Roll-to-Roll Technologies for Flexible Devices” is expected to reach $69.8 billion by the end of 2029 at a compound annual growth rate (CAGR) of 11.5% from 2024 to 2029.
Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology, Inc. That Achieves Yields Greater Than 99% for Underfilling During Semiconductor Manufacturing
06/11/2025 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson’s customer, Powertech Technology, Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. edwd
Bridging the Knowledge Gap in Test: A Conversation with Bert Horner
06/11/2025 | Barry Matties, I-Connect007Bert Horner is a seasoned industry veteran and co-creator of The Test Connection, Inc. (TTCI), a test and inspection company spanning over 45 years. In this candid conversation, Bert reflects on the challenges our industry faces with the retirement of career professionals and the subsequent loss of critical tribal knowledge. As he unveils The Training Connection’s innovative training initiatives, Bert emphasizes the importance of evolving educational programs that align with industry needs, particularly in design for test (DFT), and sheds light on strategies being implemented to foster the next generation of engineers.