-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Webinar: INEMI Printed Circuit Board Roadmap
June 13, 2025 | iNEMIEstimated reading time: 2 minutes

Join INEMI PCB Roadmap Chairs Tarja Rapala and Joe Beers for a look at what lies ahead for PCB technologies. This webinar, hosted by INEMI Director of Roadmapping Francis Mullany, will:
- Review highlights of INEMI’s 10-year roadmap for PCBs, including high-speed PCBs and substrates, laminates, mmWave PCBs, test and inspection, and environmental issues.
- Highlight next steps for the INEMI PCB Roadmap and brainstorm future directions for PCB technology.
About the INEMI Roadmap
The INEMI Roadmap charts — over a 10-year horizon — the future evolution of electronics manufacturing in terms of application and market drivers, technical needs, maturity of technical solutions, expected gaps and challenges. Modern electronic systems and applications drive the iNEMI Roadmap. The various roadmap teams focus on the full product lifecycle, from component design to manufacturing to deployment to end of life, and the complete ecosystem from materials suppliers to system integrators.
About the Speakers
Tarja Rapala-Virtanen
Technical Director, EIPC
Tarja Rapala-Virtanen is a technology professional with more than 25 years of experience in managing complex electronics projects and technology, particularly in the field of printed circuit boards. Her expertise spans various aspects of PCB technology, including interconnection and circuit board technology. She has led global engineering and R&D functions both in Finland and China and is currently the Technical Director of EIPC, the European Institute for the PCB Community. Tarja holds an M.Sc. degree in chemical engineering from Abo Akademi in Turku, Finland.
Joe Beers
Senior Vice President
Gold Circuit Electronics Global Sales and Service
Joe Beers has more than 30 years of experience in the manufacture of printed circuit boards and varied experiences as a laboratory chemist, process and product engineer, quality director and manufacturing leader. At Gold Circuit Electronics he has held a variety of positions in the areas of engineering and quality support. He has worked closely with OEM customers, with a specific focus on materials and processes, coupled with quality management and field experience. Joe graduated with a chemistry degree from Adelphi University in New York.
Registration
This webinar is open to all in the industry; advance registration is required. You will need to log into your web account (free to members and non-members) to register. If you do not have a current web account, please create one and set up your profile. If you have any questions or need additional information, please contact Francis Mullany (fmullany@inemi.org).
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Polar Instruments Announces Additive Transmission Line Support for Si9000e
08/20/2025 | Polar InstrumentsTransmission lines embedded into the PCB surface are a feature of UHDI constructions. The 2025 fall release of Polar's Si9000e PCB impedance & insertion loss transmission line field solver incorporates eight new single ended, differential and coplanar transmission line structures.
Meet the Round 1 Winners of the Bright Manufacturing Student Challenge 2025
08/20/2025 | Tara Dunn, SMTAThe Bright Manufacturing Student Challenge is an opportunity for student teams to design and develop innovative solutions for real-world electronics manufacturing problems. The eight-week competition, sponsored by the Electronics Manufacturing & Assembly Collaborative (EMAC) through electronicsworkforce.com, allows students to showcase their technical skills, creativity, and problem-solving abilities.
Inventing the Future: An Interview with Dr. Ed Schweitzer
08/20/2025 | Barry Matties, I-Connect007Dr. Edmund O. Schweitzer III, founder of Schweitzer Engineering Laboratories (SEL), has a corner office in the company’s world headquarters in Pullman, Washington. Forty-two years after his SEL-21—the first microprocessor-based digital protective relay—ushered in a new era of power-system protection, he has forever changed the way the world safeguards its electric grids. In this three-hour conversation, Dr. Schweitzer reveals that he remains excited to get to work each day, unpacking the “better, cheaper, faster, simpler” mantra that’s still driving SEL’s innovation, and the culture glue that keeps more than 7,000 employee-owners rowing in unison.
Amphenol to Acquire Trexon
08/19/2025 | BUSINESS WIREAmphenol Corporation announced a definitive agreement to acquire Trexon for approximately $1 billion in cash, subject to customary post-closing adjustments.
American Made Advocacy: Where’s the Budget for a Modern Military Run on Microelectronics?
08/19/2025 | Shane Whiteside -- Column: American Made AdvocacyIn a world of peer threats and urgent transformation, having secure, trusted, and reliable microelectronics is non-negotiable. While largely hidden, microelectronics are the ubiquitous enablers of modern defense platforms. Nothing in the current American arsenal flies, floats, or fights without a technology stack that includes a semiconductor, an integrated circuit substrate, and a printed circuit board.