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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Webinar: INEMI Printed Circuit Board Roadmap
June 13, 2025 | iNEMIEstimated reading time: 2 minutes

Join INEMI PCB Roadmap Chairs Tarja Rapala and Joe Beers for a look at what lies ahead for PCB technologies. This webinar, hosted by INEMI Director of Roadmapping Francis Mullany, will:
- Review highlights of INEMI’s 10-year roadmap for PCBs, including high-speed PCBs and substrates, laminates, mmWave PCBs, test and inspection, and environmental issues.
- Highlight next steps for the INEMI PCB Roadmap and brainstorm future directions for PCB technology.
About the INEMI Roadmap
The INEMI Roadmap charts — over a 10-year horizon — the future evolution of electronics manufacturing in terms of application and market drivers, technical needs, maturity of technical solutions, expected gaps and challenges. Modern electronic systems and applications drive the iNEMI Roadmap. The various roadmap teams focus on the full product lifecycle, from component design to manufacturing to deployment to end of life, and the complete ecosystem from materials suppliers to system integrators.
About the Speakers
Tarja Rapala-Virtanen
Technical Director, EIPC
Tarja Rapala-Virtanen is a technology professional with more than 25 years of experience in managing complex electronics projects and technology, particularly in the field of printed circuit boards. Her expertise spans various aspects of PCB technology, including interconnection and circuit board technology. She has led global engineering and R&D functions both in Finland and China and is currently the Technical Director of EIPC, the European Institute for the PCB Community. Tarja holds an M.Sc. degree in chemical engineering from Abo Akademi in Turku, Finland.
Joe Beers
Senior Vice President
Gold Circuit Electronics Global Sales and Service
Joe Beers has more than 30 years of experience in the manufacture of printed circuit boards and varied experiences as a laboratory chemist, process and product engineer, quality director and manufacturing leader. At Gold Circuit Electronics he has held a variety of positions in the areas of engineering and quality support. He has worked closely with OEM customers, with a specific focus on materials and processes, coupled with quality management and field experience. Joe graduated with a chemistry degree from Adelphi University in New York.
Registration
This webinar is open to all in the industry; advance registration is required. You will need to log into your web account (free to members and non-members) to register. If you do not have a current web account, please create one and set up your profile. If you have any questions or need additional information, please contact Francis Mullany (fmullany@inemi.org).
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