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Technic Releases TechniPad 7611
June 21, 2017 | TechnicEstimated reading time: Less than a minute
Technic has launched TechniPad 7611, an electroless process that deposits pure palladium on electroless nickel. TechniPad 7611 contains a proprietary reducing agent resulting in a highly stable process that operates well in a wide range of loading conditions while meeting specific thickness requirements.
TechniPad 7611 requires less tank maintenance than the leading competitor and has demonstrated a consistent deposit thickness in both high-volume and prototype production. To the assembler or OEM performing wire bonding, touch contacts, or soldered connections, Technic's TechniPad 7611 pure Pd deposit means a more consistent assembly with dependable electrical performance.
About Technic
Technic Inc. is a Rhode Island based, privately held corporation with over 900 employees worldwide. For over 70 years, Technic has been a global supplier of specialty chemicals, custom finishing equipment, engineered powders, and analytical control systems to the electronic component, printed circuit board, semiconductor, industrial finishing and decorative industries. Technic is also a major supplier of engineered metal powders to the solar industry.
Learn more at www.technic.com.
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PCB007 Magazine October 2024: Alternate Metallization Processes
10/16/2024 | I-Connect007 Editorial TeamTraditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop taking us into new directions. In this issue of PCB007 Magazine, we examine the impact of alternate metallization methods giving a glimpse into how and when we will arrive at 'destination metallization'.
Trouble in Your Tank: Interconnect Defect—The Three Degrees of Separation
10/01/2024 | Michael Carano -- Column: Trouble in Your TankIt has been well documented that, with a very expensive and complex printed circuit board, thermal and mechanical excursions often find weaknesses. A lack of robustness and poor process control often leads to the exploitation of those weaknesses. An interconnect defect (ICD) often goes undetected until the printed circuit board reaches the final assembly stage or undergoes multiple thermal cycles, including interconnect stress tests or thermal shock. It is impossible to rework the ICD defect. But unlike voids, if detected in time, the panels can be reprocessed.
Atotech to Participate at KPCA Show 2024
09/03/2024 | AtotechMKS’ Atotech will participate in this year’s KPCA Show 2024 in Incheon, held at Songdo Convensia from September 4-6, 2024.
Surface Finish: Tune in to the Latest Podcast Episode of On the Line with… ASC Sunstone
09/04/2024 | I-Connect007Don't miss the latest episode of "On the Line with… ASC Sunstone: Designing for Reality," in which ASC Sunstone’s General Manager, Matt Stevenson, discusses the critical topic of surface finishes in PCB manufacturing.
Connect the Dots: Designing for Reality—Electroless Copper
08/28/2024 | Matt Stevenson -- Column: Connect the DotsRoll up your sleeves because it's time to get messy. In a recent episode of I-Connect007’s On the Line with… podcast, we discussed electroless copper deposition. This process deposits a copper layer into the through-holes and vias of what will eventually be a PCB. Electroless copper deposition feels like a black box to many people. It sort of looks like a black box, too. The boards go in one side, come out the other, and emerge differently. So, let's crack open that black box and look inside.