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Day 1: Cutting Edge Insights at the EIPC Summer Conference

06/17/2025 | Pete Starkey, I-Connect007
The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.

Uyemura Expands Engineering Team in Great Lakes Region

05/30/2025 | Uyemura
Andrew Jin has joined Uyemura’s Engineering Team as Technical Service Engineer for the Midwest. Jin was formerly with Sensient Technologies, Flavors and Extracts Division, where his focus was CO2 emissions and water quality; he also did capital project work with production equipment.

Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper

05/09/2025 | Michael Carano -- Column: Trouble in Your Tank
In the business of printed circuit fabrication, yield-reducing and costly defects can easily catch even the most seasoned engineers and production personnel off guard. In this month’s column, I’ll investigate copper plating voids with their genesis in the pre-plating process steps.

Real Time with... IPC APEX EXPO 2025: Uyemura—Inside the Specialty Chemicals Market

04/03/2025 | Real Time with...IPC APEX EXPO
Rich Depoto discusses Uyemura's focus on specialty chemicals and market trends, particularly the shift towards HDI and UHDI products. Rich highlights innovations in surface adhesion and micro etches for copper, essential for high-speed transmission.

Uyemura Announces Six Sigma Graduates

04/02/2025 | Uyemura
Dr. Patrick Valentine, Technical & Lean Six Sigma Manager and Six Sigma Master Black Belt, announces the completion of Lean Six Sigma Black Belt training by 4 members of Uyemura’s professional staff.
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