-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueCounterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend won't continue. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
A Culture of Thriving
One cannot simply command thriving; it must be nurtured, developed, and encouraged. In this issue, we explore strategies to improve your working relationship model—both internally and externally. In this culture of thriving, your business will grow in the process.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Akrometrix Launches New Warpage Metrology System
June 29, 2017 | Akrometrix LLCEstimated reading time: 1 minute
Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, is pleased to announce that it has launched its newest warpage metrology system – the Tabletop Shadow Moiré (TTSM) system.
“Over the years, many of our customers who are using our systems for thermal warpage metrology have stated a need for an ultra-fast, highly accurate room temperature warpage metrology system,” stated Mayson Brooks, Akrometrix President. “Additionally, they wanted a system that was small enough for a tabletop operation and that would allow them to utilize all the software features of our thermal warpage systems, only at room temperature.”
The TTSM meets this demand – enabling customers to measure warpage of substrates up to 300mm x 310 mm (a 300mm wafer or two JEDEC trays) with the entire measurement taking less than two seconds. Whether individual parts or a JEDEC tray of multiple parts, the TTSM provides an ultra-fast and highly accurate measurement at room temperature that is suited for tabletop use.
About Akrometrix LLC
Akrometrix is the leader in thermal warpage and strain metrology for the front-end/back-end wafer, back-end packaging/assembly, panel and the PCB/component markets. The company provides both capital equipment and test services to measure warpage and strain in temperatures from -50°C to 300°C on virtually any substrate up to 600mm x 600mm, regardless of shape. Located in Atlanta, Georgia, Akrometrix has been serving customers worldwide for more than 20 years based on technology developed at Georgia Tech. For more information click here.
Suggested Items
Nortech Systems Announces Expansion of PCBA Capabilities with IPC-J-STD-001 Space Addendum
10/08/2024 | BUSINESS WIRENortech Systems Incorporated (“Nortech Systems”, or the “Company), a leading provider of engineering and manufacturing solutions for the aerospace and defense industry, has announced the Company has certified trainers and operators to build printed circuit board assemblies (PCBAs) to the IPC-J-STD-001 Space Addendum standard.
VDMA: Machine Vision Industry to Decline by 10%
10/08/2024 | VDMAThe VDMA Machine Vision sector group is forecasting a 10% drop in sales in nominal terms for the machine vision industry in Europe this year.
Nordson EFD Wins a 2024 Edge Award for the PICO® Nexμs Jetting System
10/08/2024 | Nordson EFDNordson EFD, a Nordson company (NASDAQ: NDSN), announced its new-to-market PICO Nexμs jetting system has been recognized by Machine Design magazine with a 2024 Edge Award in the Automation & IIOT category.
Inflection AI, Intel Launch Enterprise AI System
10/07/2024 | IntelInflection AI and Intel announced a collaboration to accelerate the adoption and impact of AI for enterprises as well as developers. Inflection AI is launching Inflection for Enterprise, an industry-first, enterprise-grade AI system powered by Intel® Gaudi® and Intel® Tiber™ AI Cloud (AI Cloud), to deliver empathetic, conversational, employee-friendly AI capabilities and provide the control, customization and scalability required for complex, large-scale deployments.
RTX to Develop Ultra-wide Bandgap Semiconductors for DARPA
10/03/2024 | RTXRaytheon, an RTX business, has been awarded a three-year, two-phase contract from DARPA to develop foundational ultra-wide bandgap semiconductors, or UWBGS, based on diamond and aluminum nitride technology that revolutionize semiconductor electronics with increased power delivery and thermal management in sensors and other electronic applications.