The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
Ascentech to Showcase Latest Solutions at SMTA Ohio Expo & Tech Forum
July 5, 2017 | AscentechEstimated reading time: 1 minute
Ascentech, LLC will exhibit and demonstrate its Optilia, Inspectis, and GEN3 test and process optimization instruments and solutions at the upcoming SMTA Ohio Expo & Tech Forum, which will be held July 13, 2017, at the Embassy Suites Cleveland Rockside in Independence (Cleveland), Ohio.
Ascentech will demonstrate the new INSPECTIS high definition optical inspection system, a complementary partner to the highly-flexible Optilia AB line of inspection systems. INSPECTIS is a plug and play, reliable, cost-effective high-definition camera microscope. It is designed for optical inspection, quality control, PCB inspection, non-contact measurements, and much more in a competitively-priced, all-in-one ergonomic package now offered by Inspectis Optical Systems AB of Stockholm, Sweden.
Other exhibited products will include the award-winning GENSONIC Ultra-Sonic Stencil Cleaner and GEN3 Systems Solder Saver, a solder/dross separation tool. The Gensonic is a manually-operated, ultrasonic transducer unit for cleaning stencils used in printing solder pastes and adhesives. It can be used either directly on the printer or at a separate cleaning station.
The GEN3 Solder Saver is a handheld, compact system for separating dross from good solder. The unit easily reduces hardened dross material to oxide powder, making it possible to remove the dross oxide waste from the solder pot, leaving valuable solder in the pot.
About Ascentech LLC
Ascentech LLC is the North American Distributor for Inspectis Optical Systems AB, Optilia Instruments AB, as well as GEN3 Systems, and also supplies the industry with other testing and process optimization solutions for electronics manufacturing. To learn more, click here.
Share on:
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.