Knocking Down the Bone Pile: Solderability Test Methods, Myths, and Realities
Global Sourcing Spotlight: Building Long-term Supplier Relationships 
Standard of Excellence: Handling Difficult Customers With Grace and Professionalism
Koh Young to Debut Meister Series at SEMICON West 2017
July 6, 2017 | Koh Young TechnologyEstimated reading time: 1 minute
Koh Young Technology will launch its new Meister Series at SEMICON West, which will be held July 11–13 at the Moscone Center in San Francisco, California.
The series, which includes Meister-SPi (solder paste inspection) and Meister-MCi (mounted chip inspection), will be on display with the new theme “True 3D now powered by Intelligent Platform for Smart Factory” at Koh Young’s booth (5150).
Koh Young’s Meister, as the name implies, has the most optimized 3D inspection solutions for advanced IC packaging. For example, it can measure volume, area, height, and diameter of virtually any packaging like SiP, 2.5D, 3D WLP, WLCSP, and FOWLP, among others. Also, Koh Young’s powerful SPC@KSMART allows tracking a wide range of defects from insufficient/excess solder, to bridge, XY position, abnormal shape, and applying changes to inspection programs in real-time.
Another distinguishing feature of Meister series is its simple inspection setting. Due to its user-friendly inspection setting software, no fine-tuning or base reference teaching is required.
The Meister-SPi combines Koh Young’s innovative vision algorithms with advanced high-resolution optics for the semiconductor industries. This innovative SPi system will be configured with high resolution 12MP 5µm optics and high-speed camera, offering best-in-class inspection capability for mass production. With precise resolution, Meister-SPi enables down to 10µm thin solder inspection.
The Meister-MCi, the 3D Automated Optical (AOI) solutions for semiconductor business, helps enhancing the manufacturing yields and product reliability with high WPH (wafer per hour). With advanced image processing at mass production line, it allows accurate measurement of high height object.
“Having a strong reputation in US market, Koh Young has been helping worldwide 2,400 customers to realize agile manufacturing innovation,” stated Jay Park, Head of Semicon Business Division at Koh Young Technology. “We are excited to show our latest innovations to visitors in upcoming SEMICON West.”
About Koh Young Technology Inc.
Koh Young Technology, a leading provider of Solder Paste Inspection (SPI) and Automated Optical Inspection (AOI) systems, specializes in the design and manufacturing of 3D measurement and inspection equipment for the global circuit board assembly and semiconductor markets. Direct sales and support centers are in the United States, Germany, Japan, Singapore, China and Korea. For more information about the company, visit www.kohyoung.com.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Indium Expert to Tackle Reliability Challenges in AI and High-Performance Computing at EPTC 2025
11/27/2025 | Indium CorporationIndium Corporation Research Metallurgist Huaguang Wang, Ph.D., will deliver a presentation at the 27th IEEE Electronics Packaging Technology Conference (EPTC 2025). The conference will be held December 2-5, 2025, in Singapore.
Altus Supports Concurrent Technologies’ Production Expansion with Advanced Inline Vapour Phase System
11/26/2025 | Altus GroupAltus Group, a leading distributor of capital equipment for the electronics industry, has successfully supplied Concurrent Technologies Plc (Concurrent), a designer and manufacturer of mission-critical embedded computing solutions, with their second ASSCON vapour phase soldering system, the innovative VP2100-100 inline unit.
Knocking Down the Bone Pile: Solderability Test Methods, Myths, and Realities
11/26/2025 | Nash Bell -- Column: Knocking Down the Bone PileSolderability testing answers a simple question: How readily will a termination form a sound solder joint under defined conditions? It is not component preconditioning. Rather, it evaluates wetting—the speed and extent to which molten solder spreads and adheres to a surface—using controlled methods (e.g., visual “dip-and-look” or wetting-balance measurements). Results reflect the combined effects of termination finish, storage and handling, flux activity, and the solder alloy in use.
Indium Experts to Present on Power Electronics at productronica 2025
11/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly and e-Mobility industries, Indium Corporation® experts will share their technical insight and knowledge on a variety of industry-related topics during Productronica, November 18-21, in Munich, Germany.
ESCATEC Installs Third Wave Soldering Machine in Penang to Meet Growing Demand
11/14/2025 | ESCATECESCATEC’s business unit in Penang, ESCATEC Electronics Sdn Bhd (EEM), recently welcomed the installation of an advanced Ersa POWERFLOW ULTRA wave soldering system, strengthening its capabilities and production capacity for customers bringing complex high-tech products to market.