-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSpotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
What's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Koh Young to Debut Meister Series at SEMICON West 2017
July 6, 2017 | Koh Young TechnologyEstimated reading time: 1 minute
Koh Young Technology will launch its new Meister Series at SEMICON West, which will be held July 11–13 at the Moscone Center in San Francisco, California.
The series, which includes Meister-SPi (solder paste inspection) and Meister-MCi (mounted chip inspection), will be on display with the new theme “True 3D now powered by Intelligent Platform for Smart Factory” at Koh Young’s booth (5150).
Koh Young’s Meister, as the name implies, has the most optimized 3D inspection solutions for advanced IC packaging. For example, it can measure volume, area, height, and diameter of virtually any packaging like SiP, 2.5D, 3D WLP, WLCSP, and FOWLP, among others. Also, Koh Young’s powerful SPC@KSMART allows tracking a wide range of defects from insufficient/excess solder, to bridge, XY position, abnormal shape, and applying changes to inspection programs in real-time.
Another distinguishing feature of Meister series is its simple inspection setting. Due to its user-friendly inspection setting software, no fine-tuning or base reference teaching is required.
The Meister-SPi combines Koh Young’s innovative vision algorithms with advanced high-resolution optics for the semiconductor industries. This innovative SPi system will be configured with high resolution 12MP 5µm optics and high-speed camera, offering best-in-class inspection capability for mass production. With precise resolution, Meister-SPi enables down to 10µm thin solder inspection.
The Meister-MCi, the 3D Automated Optical (AOI) solutions for semiconductor business, helps enhancing the manufacturing yields and product reliability with high WPH (wafer per hour). With advanced image processing at mass production line, it allows accurate measurement of high height object.
“Having a strong reputation in US market, Koh Young has been helping worldwide 2,400 customers to realize agile manufacturing innovation,” stated Jay Park, Head of Semicon Business Division at Koh Young Technology. “We are excited to show our latest innovations to visitors in upcoming SEMICON West.”
About Koh Young Technology Inc.
Koh Young Technology, a leading provider of Solder Paste Inspection (SPI) and Automated Optical Inspection (AOI) systems, specializes in the design and manufacturing of 3D measurement and inspection equipment for the global circuit board assembly and semiconductor markets. Direct sales and support centers are in the United States, Germany, Japan, Singapore, China and Korea. For more information about the company, visit www.kohyoung.com.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
MacDermid Alpha Showcases Advanced Interconnect Solutions at PCIM Asia 2025
09/18/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronic Solutions, a global leader in materials for power electronics and semiconductor assembly, will showcase its latest interconnect innovations in electronic interconnect materials at PCIM Asia 2025, held from September 24 to 26 at the Shanghai New International Expo Centre, Booth N5-E30
Breakthrough in Non-Contact Solder Removal Earns Kurtz Ersa 2025 Mexico Technology Award at SMTA Guadalajara
09/18/2025 | Kurtz Ersa Inc.Kurtz Ersa Inc., a leading supplier of electronics production equipment, is proud to announce that it has been awarded a 2025 Mexico Technology Award in the category of Rework & Repair for its HR 600P Automatic Rework System.
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
Koh Young, Fuji, and Kurtz ERSA Drive Smart Manufacturing Solutions for EV and Automotive Electronics at Kunshan, China Technical Seminar
09/11/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, partnered with Fuji Corporation and Kurtz ERSA to host an exclusive technical seminar for leading automotive manufacturers in East China. Held on September 4 at Fuji’s factory in Kunshan, the event gathered participants representing over 35 companies.
MacDermid Alpha Presents at SMTA New Delhi, Bangalore Chapter, on Flux–OSP Interaction
09/09/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha contributes technical insights on OSP solderability at the Bangalore Chapter, SMTA reinforcing commitment to knowledge-sharing and industry collaboration.