Learning With Leo: UHDI—The Next Leap in PCB Manufacturing
Nolan’s Notes: Is Mexico the Pulse of Electronics in the Americas?
Standard of Excellence: Speed vs. Quality in Customer Service
Register Now for the IPC Fall Standards Committee Meetings
July 6, 2017 | IPCEstimated reading time: Less than a minute
Registration is now open for the IPC Fall Standards Development Meetings, which will once again be co-located with SMTA International, to be held on September 16–21 in Rosemont, Illinois.
The IPC Standard Development Committees cover a range of topics, including:
- Assembly & Joining
- Assembly Equipment
- Base Materials
- Cleaning & Coating
- Electronic Documentation Technology
- Electronic Product Data Description
- Embedded Devices
- Environment, Health and Safety
- Fabrication Processes
- Flexible and Rigid-Flex Printed Boards
- High Speed/High Frequency Interconnections
- Management
- Packaged Electronic Components
- Printed Board Design Technology
- Printed Electronics
- Process Control
- Product Assurance
- Product Reliability
- Rigid Printed Boards
- Terms and Definitions
- Testing
Register by August 25 and save 10% on the combined IPC Standards Meetings and SMTA Conference.
For more information, click here.
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Innatera Signs Joya as ODM Customer, Bringing Neuromorphic Edge AI into Everyday Connected Products
11/13/2025 | PRNewswireInnatera, the leader in brain-like neuromorphic computing for ultra-low-power intelligence at the sensor edge, today announced that Xiamen Joyatech Co., Ltd. has become its first Original Design Manufacturer (ODM) customer.
Advanced Electronics Packaging Digest: Third Issue Arrives November 17
11/12/2025 | I-Connect007The third issue of Advanced Electronics Packaging Digest launches Monday, November 17. This issue continues AEPD’s mission to deliver forward-looking analysis and insider perspectives on the technologies reshaping advanced electronics packaging. Among the highlights is a review of IMPACT 2025, where discussions on component-to-system-level integration took center stage as experts explored the challenges and breakthroughs driving advanced packaging technologies.
Electronic Design Automation (EDA) Market Size to Reach $811.1 Million by 2030
11/12/2025 | PRNewswireThe Global Electronic Design Automation (EDA) Market was estimated to be worth USD 541 Million in 2023 and is forecast to a readjusted size of USD 811.1 Million by 2030 with a CAGR of 6.4% during the forecast period 2024-2030.
The Technical Backbone of an EMS Company: A CEO’s Perspective
11/12/2025 | Jay Rupani, Precision PCBAs the CEO of an EMS company, I often say that our business runs on precision, innovation, and trust. Behind every finished product—whether it’s a medical device, an automotive control module, or a consumer gadget—lies a sophisticated technical ecosystem that makes it all possible. From design support and process engineering to automation, data analytics, and supply chain integration, the technical side of EMS is where our value truly shines.
ASE Unveils IDE 2.0 – AI-Enhanced Platform Accelerates Package Design Accuracy and Innovation
11/12/2025 | ASE GroupAdvanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd., announced the launch of IDE 2.0, a major upgrade to its Integrated Design Ecosystem™ (IDE) platform.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in