-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueEngineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Taiwan PCB Firms Post Revenue Growth in June
July 7, 2017 | DigitimesEstimated reading time: Less than a minute
HDI PCB manufacturer Compeq Manufacturing, and flexible PCB specialists Zhen Ding Technology and Flexium Interconnect all enjoyed revenue growth in June, according to Digitimes.
Compeq posted revenues of NT$3.89 billion ($127.2 million) in June 2017, up 27.8% on year and 10.8% sequentially.
Zhen Ding and Flexium reported sequential increases in June revenues of 35.87% and 33.18%, respectively. Zhen Ding generated revenues of NT$6.41 billion in June 2017, up 17.1% on year, while revenues at Flexium climbed 23.6% from a year earlier to NT$1.5 billion in June 2017.
Suggested Items
Biden-Harris Administration: CHIPS Incentives Award with Intel to Advance U.S. Leading-Edge Chip Capacity
11/27/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce awarded Intel Corporation up to $7.865 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities. The award follows the previously signed preliminary memorandum of terms, announced on March 20, 2024, and the completion of the Department’s due diligence.
WSTS Semiconductor Market Forecast Spring 2024
11/26/2024 | WSTSWSTS has adjusted its Spring 2024 forecast upwards, projecting a 16.0 percent growth in the global semiconductor market compared to the previous year.
Server DRAM and HBM Boost 3Q24 DRAM Industry Revenue by 13.6% QoQ
11/26/2024 | TrendForceTrendForce’s latest investigations reveal that the global DRAM industry revenue reached US$26.02 billion in 3Q24, marking a 13.6% QoQ increase.
Biden-Harris Administration: CHIPS Incentives Award to TSMC Arizona
11/15/2024 | U.S. Chamber of CommerceTSMC Arizona Corporation (TSMC Arizona), a subsidiary of Taiwan Semiconductor Manufacturing Company Limited (TSMC), up to $6.6 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
GPV’s Interim Financial Report Q3 2024: Keeping Pace in Challenging Market
11/15/2024 | GPVGPV reported sales of DKK 2.2 billion and earnings (EBITDA) of DKK 186 million for Q3 2024. This was a slight decline compared to the same quarter in the record year of 2023, and thus, GPV kept pace in a global market affected by continued market rebalancing and declining end-customer demand.