Proposed IEC Standard on Halogen-Free Raises Concerns
July 10, 2017 | IPCEstimated reading time: 1 minute
Like the game Whack-a-Mole, the idea of a standard for low-halogen electronics keeps popping up. Originally, proposed as an IPC specification of chlorine and bromine in copper-clad laminates, IEC 61249-2-21 was established many years ago to define FR-4 products for halogen-free.
Then about a decade ago, concerns about certain toxic bromine-containing flame-retardants (polybrominated biphenyls (PBBs) and polybrominated diphenyl ethers (PBDEs) and concerns regarding incomplete combustion of PVC and bromine-containing plastics in electronics led to the passage of the EU WEEE Regulation and RoHS Directive which banned the toxic substances and mandated appropriate handling of waste electronics.
Despite the removal of any toxic halogen-containing compounds from the electronics supply chain, IPC and JEDEC members began discussions about the development of a standard for low halogen electronics. IPC, with its broad membership and open voting processes, never approved the low halogen standard, which was deemed to be a marketing tool posing as an environmental standard. JEDEC, with its narrower membership, went ahead and passed and published "Definition of 'Low Halogen' for Electronic Products” in 2015.
In 2016, the JEDEC standard was temporarily (up to six years) approved by IEC TC 111 (environmental standardization committee) as an IEC publicly available specification (PAS), despite the broad questions that were raised regarding technical validity. Revision and permanent adoption of the standard is now being considered by TC 111. The proposed revision would define electronics as “Low Halogen” when they “contain less than 0,9% (by mass) total elemental halogen content (F+Cl+Br+I) and meet the thresholds of all halogenated substances in IEC 91 62474 database." The proposed standard is concerning not just because of the content of the proposal, but by the labeling of low halogen as an environmental standard.
The standard is in the Committee Draft Phase which means it is being circulated for comments to all IEC TC111 member countries. The deadline for comment is September 15, 2017. If you are concerned, contact your country’s IEC National Committee and the IEC TC111 representatives.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Statement from the Global Electronics Association on the July 2025 Tariff on Copper Foil and Electronics-Grade Copper Inputs
07/31/2025 | Global Electronics AssociationWe are disappointed by today’s decision to impose a 50% tariff on imported copper foil and other essential materials critical to electronics manufacturing in the United States.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
08/01/2025 | Nolan Johnson, I-Connect007We start with the latest report from the Global Electronics Association: North American PCB sales are down 8.6% in June. That might sound grim, but keep reading—there’s more to the story. Bookings are holding steady, and Dr. Shawn DuBravac offers context that paints a more balanced picture. Next, we turn our gaze to India, where mobile phone exports have surged 127-fold over the past decade. That stat alone says volumes about India’s emergence as a force in electronics manufacturing, something we’ll be digging into more deeply in an upcoming SMT007 feature.
iDEAL Signs Technology Partner Agreement for SuperQ MOSFETs with Power System Specialist Richardson Electronics, Ltd.
08/01/2025 | PR NewswireiDEAL Semiconductor, a fabless power semiconductor company focused on delivering breakthrough efficiencies, has announced it will partner with Power and RF specialist, Richardson Electronics.
Brent Laufenberg Appointed CIO of the Global Electronics Association, Advancing Technology and Member Services
07/31/2025 | Global Electronics AssociationThe Global Electronics Association (formerly IPC International Inc.) announces the appointment of Brent Laufenberg as its new Chief Information Officer (CIO).
Federal Electronics Mexico Enhances SMT Line with Installation of Heller Industries Reflow Oven
08/01/2025 | Federal ElectronicsFederal Electronics, a leader in providing advanced electronic manufacturing services, has enhanced its surface mount technology (SMT) operations with the installation of a new Heller Industries reflow oven at its facility in Hermosillo. This upgrade supports the company’s continued growth in high-reliability markets such as aerospace, medical, industrial, and instrumentation.