-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Koh Young Technology Delivers 10,000th Inspection System
July 10, 2017 | Koh Young TechnologyEstimated reading time: 2 minutes
Koh Young Technology recently announced the delivery of its 10,000th 3D inspection system, a Zenith 3D Automated Optical Inspection (AOI) system, sold to Delphi Electronics Co. Ltd in Suzhou, China. The Zenith system measures the true profilometric shape of components, solder joints, patterns and even foreign material on assembled PCBs with true three-dimensional accuracy and with comprehensive IPC 610 comparison.
The milestone was celebrated at the Delphi plant, and was attended by JD Shin, Director of Global Sales and Support at Koh Young Technology, Steven Choi, General Manager of Koh Young China, Joe Lee, Process Engineering Manager and Zhao Jun, Staff Engineer at the Delphi Suzhou plant. Delphi Automotive is a high-technology company that integrates safer, greener and more connected solutions for the automotive and transportation sectors. The company has been operating in China since 1993, with more than 20 sites and supplying products to 17 of the top 20 automakers in China.
Koh Young Technology has been the fastest-growing 3D inspection system provider with No.1 market share in the world, having closed all 10,000 orders since the company’s founding in 2002. Koh Young recently marked its 15th Foundation Day on May 1. With increased dominance of 3D AOI, Koh Young has consolidated its position as the global leader of SMT inspection equipment.
In marking the order milestone, Dr. Kwangill Koh, CEO of Koh Young Technology said, "We are very pleased to celebrate this occasion with Delphi Electronics Suzhou, our trusted partner since 2003. To our team, delivering 10,000 machines is indeed a remarkable achievement; it has been a challenge, and also a great success, because Koh Young is the first inspection company in the SMT industry to break this sales record. But it doesn’t end here; 10,000 deliveries is only the beginning as we continue to help SMT PCB manufacturers around the world build a better process with Koh Young."
At the ceremony, JD highlighted Koh Young's technological milestones, introducing its latest innovations, followed by the presentation of awards. "This milestone also carries momentum for continuing success," JD added. "We will re-double our efforts to continue to provide the world’s best 3D inspection technology, enabling our customers to implement agile, lean manufacturing systems," JD concluded.
"We have chosen to work with Koh Young because of its superior inspection capability on solder joints which uses exclusive IPC 610 standard," said Joe Lee, Process Engineering Manager, Delphi Electronics Suzhou Co. Ltd. "We would like to congratulate the Koh Young team on their remarkable milestone."
Koh Young Technology has always been a pioneer in inspection and measurement technology, beginning with the world’s first 3D solder paste inspection (SPI) in 2004. Now, the company's KSMART Solution, anticipating Industry 4.0 by integrating advanced artificial intelligence (AI) knowledge, helps customers realize Smart Factory visions with the advantages of reliable full 3D measurement data.
About Koh Young Technology Inc.
Koh Young Technology, a leading provider of Solder Paste Inspection (SPI) and Automated Optical Inspection (AOI) systems, specializes in the design and manufacturing of 3D measurement and inspection equipment for the global circuit board assembly and semiconductor markets. Direct sales and support centers are located in the United States, Germany, Japan, Singapore, China and Korea. For more information, visit www.kohyoung.com.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.