-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
SEHO North America to Hold Technology Days in Kentucky
July 13, 2017 | SEHO North America, Inc.Estimated reading time: 1 minute
SEHO North America, Inc. announced that it will hold its 2017 Technology Days in conjunction with guest presenters from ULT LLC (fume extraction technologies), DCT Czech (process cleaning technologies) and Stannol GmbH (soldering flux technologies). The event is scheduled to take place July 25-26, 2017 at SEHO’s North America new technology center in Erlanger, Kentucky.
This year’s NA Technology Days will be an event not to be missed, with exciting product introductions and intensive hands-on training.
SEHO Technology Days are designed to provide a perfect balance of theory and practical application. In addition to hands on trainings, this year’s event will include presentations from leading flux, solder and equipment suppliers. Industry experts will present their latest findings and share expert insight on the latest industry issues and trends.
Topics of discussion will include resource-efficient and cost-effective wave soldering as well as automated selective soldering process control with a focus on zero-defect process.
Experts will provide tips for detecting defects early to optimize the THT production process, and solutions with creative systems for automatic board handling and material management. Guest presenters also will address effective fume extractions in electronics manufacturing, maintenance cleaning of soldering technology, and the changing requirements for fluxes and solders over the last decade.
The Technology Days are part of the successful SEHO Academy with more than 1,000 satisfied attendees worldwide. SEHO's training courses can help qualified employees optimize processes to improve production throughput, reduce cycle times, improve the level of quality, and reduce overall cost.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.