Nolan’s Notes: Finding Your Sweet Spot
Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
Koh Young Technology Receives Bosch Global Supplier Award
July 25, 2017 | Koh Young TechnologyEstimated reading time: 1 minute
Koh Young Technology has received a supplier award in the 'purchasing of indirect material' category at Robert Bosch GmbH's recent Global Supplier Award 2017. The award recognizes outstanding performance Koh Young’s employees made in 2015-2016.
This year, Bosch has given awards to 44 suppliers from 11 countries for outstanding performance in the manufacture and supply of products—notably in the areas of quality, costs, innovations, and logistics. Globally, Koh Young is the second SMT-related company to win this kind of award from Bosch among thousands of suppliers.
Dr. Kwangill Koh, CEO of Koh Young Technology, received the award presented by Prof. Dr. Stefan Asenkerschbaumer, deputy chairman of the board of management of Robert Bosch GmbH.
The theme of this year's award ceremony was "Partners in Success" because to Bosch, its suppliers are not only deliverers of parts and component, but also partners in development and innovation who help them stay competitive. At the ceremony, Dr. Stefan Asenkerschbaumer praised all the award-winners. "Our goal is to achieve supply chain excellence. This will work only when all partners are intelligently connected with one another," he says.
"We are incredibly honored to receive this award from Bosch, who has been our trusted partner for more than 10 years. Without help of partners like Bosch, we cannot stay ahead of the technology curve," says Dr. Koh. "I hereby thank Bosch for their continued support and all our employees for making this possible."
About Koh Young Technology Inc.
Koh Young Technology, a leading provider of solder paste inspection (SPI) and automated optical inspection (AOI) systems, specializes in the design and manufacturing of 3D measurement and inspection equipment for the global circuit board assembly and semiconductor markets. Direct sales and support centers are located in the United States, Germany, Japan, Singapore, China and Korea. For more information, visit www.kohyoung.com.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.