X-Ray Inspection of Lead and Lead-Free Solder Joints

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KOKI Solder America Appoints Horizon Sales as Manufacturers’ Representative

05/19/2026 | KOKI Solder America
KOKI Solder America is pleased to announce a new partnership with Horizon Sales, who will now serve as the company’s manufacturers’ representative across Wisconsin, Illinois, and Florida.

Indium Experts to Address Data Center Thermal Management and Sintering Standards at SMTA Conference

05/13/2026 | Indium Corporation
As a leading materials provider for the advanced electronic packaging market, Indium Corporation® experts will share their technical insight and knowledge on two critical industry topics—data center thermal management and sintering protocols—at the SMTA Electronics in Harsh Environments Conference, May 19-21, in Amsterdam, Netherlands.

KYZEN to Focus on Aqueous and Stencil Cleaning Solutions at SMTA Juarez Expo and Tech Forum

05/12/2026 | KYZEN
KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Monterrey Expo & Tech Forum scheduled to take place on Thursday, May 21 at Injectronics Convention Center in Ciudad Juarez, Chihuahua.

Knocking Down the Bone Pile: Precision Milling of Underfilled SMT Components

05/13/2026 | Nash Bell -- Column: Knocking Down the Bone Pile
Underfill is a polymeric material used to fill the gap between a printed circuit board and the underside of surface-mount area-array packages such as BGA, QFP, and QFN devices, thereby surrounding and protecting the solder interconnections. This material increases the component's reliability when subjected to mechanical impacts and shocks by distributing forces. 

BGA Technology Expands Inspection Capabilities with Creative Electron TruView X-ray System

05/08/2026 | BGA Technology
BGA Technology, a leading provider of advanced electronics testing and inspection services, has enhanced its inspection capabilities with the addition of a Creative Electron TruView™ Simplex X-ray system at its Holbrook, New York facility.