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Testimonial

"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."

Julia McCaffrey - NCAB Group

Suggested Items

New Podcast Episode: How Does UHDI Benefit SWaP?

10/01/2025 | I-Connect007
In podcast episode 4, “SWaP Considerations,” host Nolan Johnson welcomes back industry expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC). Together, they explore how UHDI delivers measurable advantages in size, weight, and power (SWaP)—unlocking new possibilities in speed, efficiency, and miniaturization.

New Podcast Episode Drop: Optimize the Interconnect—It’s a Wrap!

09/29/2025 | I-Connect007
The final episode of the On the Line with… Optimize the Interconnect podcast series ties together insights from across the program, underscoring the growing importance of unified solutions for high-volume HDI PCB manufacturing. Final guest Kuldip Johal, Chief Technology Officer and Vice President of Business Development, emphasized that manufacturers must balance yield, reliability, and scalability as interconnect density and complexity continue to increase.

How Does UHDI Improve Routing Capabilities? Listen to Episode 3 Now and Discover

09/29/2025 | I-Connect007
Episode 3 of On the Line With... American Standard Circuits, “How Does Ultra HDI Benefit: Routing Capabilities,” features host Nolan Johnson in conversation with returning guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC). Together, they explore how UHDI technology is transforming design for manufacturability and expanding what’s possible in routing capabilities.

On the Line With… Podcast: UHDI and RF Performance

09/22/2025 | I-Connect007
I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra High Density Interconnect (UHDI).

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Zuken reveals details of the upcoming 2026 release of E3.series, which will introduce powerful new features aimed at streamlining electrical and fluid design, enhancing multi-disciplinary collaboration, and boosting engineering productivity.
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