Learning With Leo: UHDI—The Next Leap in PCB Manufacturing
Nolan’s Notes: Is Mexico the Pulse of Electronics in the Americas?
Standard of Excellence: Speed vs. Quality in Customer Service
Koh Young America Beats Q2 Estimates with Strong Sales in 3D AOI
August 8, 2017 | Koh Young AmericaEstimated reading time: 2 minutes
Koh Young Technology reported a 24 percent quarterly revenue increase for the quarter ended 30 June 2017. Beyond top line growth, the company realized its most profitable quarter ever, thanks in part to its wholly-owned subsidiary, Koh Young Americas.
Since its ribbon-cutting ceremony in 2010, Koh Young Americas continues growing at a rate far outpacing the overall inspection segment. The growth rate, underpinned by converted customers, emphasizes the industry is quickly embracing the company’s innovative technology and leadership. While its world-leading SPI market position remains unchallenged, a strengthening AOI leadership position with its True 3D systems helped Koh Young Americas attain a nearly 40 percent quarter-on-quarter growth rate.
The Zenith AOI series performed exceptionally well. The Zenith series measures true profilometric shape components, solder joints, patterns, and even identifies foreign material on assembled PCBs, all using True 3D measurement. Because the Zenith offers significant process advantages including lower false calls and higher productivity, its popularity has surged among electronic manufacturers across the global electronics manufacturing industry.
Looking forward, Koh Young expects to continue its record-setting performance. At SEMICON West in San Francisco, Koh Young launched the Meister series, which is focused on the unique semiconductor inspection requirements. At the show, Koh Young demonstrated two variations of the platform: Meister-SPi (Solder Paste inspection) and Meister-MCi (Mounted Chip inspection). The inspection machines are the latest element from Koh Young to provide "True 3D powered by Intelligent Platform for Smart Factory."
"We are extremely pleased the market continues to embrace our inspection solutions. Our growth is unparalleled and we will continue to invest in the people and resources needed to continue providing our customers with outstanding service and support," says Juan Arango, general manager of Koh Young Americas. "Combining the momentum from our True 3D inspection solutions with the new Meister series and our integrated KSMART process control center will continue to provide customers with the innovative solutions they expect from the world’s leading inspection company."
About Koh Young Technology Inc.
Koh Young Technology Inc., the leading 3D measurement-based inspection equipment and solutions provider, performs an essential role for quality control and process optimization across a growing set of industries including printed circuit board assembly, machining and assembly process manufacturing, semiconductor manufacturing, and various medical fields. In addition to corporate headquarters in Seoul, Korea, Koh Young has established sales and support offices in Germany, Japan, Singapore, China, and the United States. The local facilities ensure Koh Young maintains close communication and support with our customers, while providing a global network to support its customers.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Learning With Leo: UHDI—The Next Leap in PCB Manufacturing
11/05/2025 | Leo Lambert -- Column: Learning With LeoHigh density interconnect (HDI) technology has been a cornerstone of miniaturized electronics since Hewlett-Packard introduced the first chip-scale implementation in 1982. Over time, HDI processes became central to organic flip-chip packaging in the semiconductor industry. Today, the convergence of IC substrates and system-level PCBs has accelerated the adoption of UHDI.
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.