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EIPC Extends Deadline for Submission of Abstract for Winter Conference Lyon 2018
August 24, 2017 | EIPCEstimated reading time: Less than a minute
The European Institute for the PCB Community (EIPC) is extending the deadline for the submission of abstracts for paper presentation at the Winter Conference Lyon 2018, which will be held on February 1–2, 2018 in Alstom, France.
Abstract submission should be no later than September 10.
Click here for the detailed call for papers.
Click here for the abstract submission form.
Click here for the conference registration form
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