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TRI Brings New Perspective for 3D Inspection at SMTAI 2017
August 11, 2017 | TRIEstimated reading time: 1 minute
Test Research Inc. (TRI) will join SMTA International 2017, to be held at Donald E. Stephens Convention Center in Rosemont, Illinois, to showcase its latest 3D automated inspection solutions for PCBA manufacturing. TRI will be at Booth #424.
"We are thrilled to see how TRI 3D solutions help our customers increase production efficiency," comments TRI VP of Sales and Marketing Jim Lin. "This year we are bringing the inspection performance and factory integration to a whole new level."
Presenting an integrated solution for the PCBA production line, TRI will exhibit the Global Technology Award-winning TR7007 QI 3D SPI, along with 2D + 3D AOI solution TR7 500QE offering unique side view inspection. Both systems deliver industry leading performance based on CoaXpress Imaging Technology. TRI will showcase the world's most powerful Tiny In-Circuit-Tester Solution, TR5001T SII TINY.
Join an SMTA International Tech Tour and visit TRI at Booth #424. The company's experts will demonstrate the advantages that TRI's Industry 4.0-ready smart inspection software and high-performance hardware design can bring to your production.
About TRI
TRI offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs) and In-Circuit Test equipment, TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at www.tri.com.tw.
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