Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
Metcal Features Innovative Bench-top Soldering Equipment at SMTAI 2017
August 16, 2017 | MetcalEstimated reading time: 1 minute
Metcal will exhibit at SMTA International 2017, scheduled to take place September 19-20, 2017 at the Donald Stephens Convention Center in Rosemont, Illinois. The company will showcase innovative new products including its Connection Validation Hand Soldering System with monitoring software (CV-5210), High Thermal Demand (HTD) handpiece, and introduce the new AC-STC Solder Tip Cleaner. Metcal will be in Booth 208.
Metcal has been making a strategic move in industrial ingenuity by introducing multiple new products in 2017.
Connection Validation is Metcal’s latest patented technological innovation that is reinventing hand soldering! Built on the company's SmartHeat technology, used in all Metcal soldering systems, Connection Validation evaluates the quality of the solder joint by calculating the intermetallic compound formation and providing closed-loop feedback to the operator, mitigating risk in the process. Metcal has also just released the CV Monitoring Software that will improve your solder process traceability and create a performance baseline to quickly analyse your soldering performance, identify changes in your solder conditions, and allow you to make changes to your process.
The new High Thermal Demand (HTD) solution, comprised of a new handpiece and a selection of thermal efficient cartridges, is designed for use with Metcal’s MX line of power supplies. HTD transforms a Metcal MX-series soldering station into a powerhouse for applications with high thermal loads such as dense boards, without damaging sensitive components.
Metcal’s innovative new Solder Tip Cleaner removes oxidation and extends the tip life of your soldering tip. This easy-to-use cleaner senses the tip when inserted into the unit and activates automatically, saving the operator time.
About Metcal
Metcal is a benchtop solutions expert that has delivered broad value to customers since its Silicon Valley beginnings in 1982. Offering unrivalled performance, risk mitigation, and ROI, we give electronics manufacturers in automotive, aerospace, medical devices and military sectors the tools—and the confidence—they need to develop faster, safer, more advanced products. Metcal provides advanced technology products across hand soldering, convection rework, fume extraction, and fluid dispensing applications. For more information, click here.
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.