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Essemtec to Demo All-in-One Jetting/Placement System at SMTAI 2017
August 17, 2017 | EssemtecEstimated reading time: 1 minute
Essemtec will demonstrate its new FOX2 system, which combines jetting of solder paste or glue and placement in a single machine, at the SMTA International 2017, which is scheduled to take place September 19-20, 2017 at the Donald Stephens Convention Center in Rosemont, Illinois. Essemtec will be in Booth 207.
FOX2 has a machine footprint of just 1m2 and can accept PCB sizes up to 16 x 12". Components with sizes from 01005 up to 1.3 x 3.1" are placed. The machine achieves 10,800 cph (IPC9850) with the release of ePLACE 23 and still remains 50 µm accuracy, 3 sigma with a two nozzle head.
The new version is based on the original award-winning platform, which is the first machine in its class with linear motors and a mineral cast frame, providing excellent speed, stability, accuracy, and making it perfectly suited for use in small to medium production environments.
About Essemtec AG
Essemtec AG is a privately held Swiss equipment manufacturer, specializing in high speed fluid dispensing as well as flexible high-mix SMT placement solutions. Both divisions leverage the company’s vast equipment and process know-how gained since 1991 to let their customers achieve significant competitive advantages. The company’s goal is to improve its customers’ workflows, setup times, defect rates, traceability and overall manufacturing efficiency through superior software and by providing managed SMT storage.
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