Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Koh Young to Unveil 3D Pin Inspector at NEPCON South China 2017
August 22, 2017 | Koh Young TechnologyEstimated reading time: 1 minute
Koh Young Technology will unveil its new 3D Pin Inspector KY-P3 at NEPCON South China, which is scheduled to take place August 29–31, 2017 at the Shenzhen Convention & Exhibition Center in Shenzhen, China. Koh Young will be at Booth 1F45.
KY-P3 3D Pin Inspector, founded upon Koh Young's 3D AOI technology, delivers true 3D inspection without concern for inaccuracies resulting from conventional 2D inspection. This latest innovative system provides easy inspection setting and modification based on quantified inspection result.
Also on display, Koh Young Technology will demonstrate 3D foreign material inspection algorithm for the full 3D AOI system Zenith UHS. Apart from measuring and inspecting all kinds of defects without sacrificing accuracy and speed, it also improves PCB quality control by detecting foreign materials on whole PCB surface.
Moreover, Koh Young will demonstrate how their integrated KSMART solutions can establish perfect data feedback using quality data. The KSMART solution is a measurement-based process analysis solution, which allows manufacturers to implement industry 4.0 with reliable full 3D measurement data. This year, Koh Young will highlight the key features of KSMART solutions such as SPC@KSMART and OLD@KSMART including KSMART Process Optimizer (KPO), which helps review, diagnose, and optimize printing processes.
About Koh Young Technology Inc.
Koh Young Technology Inc., the leading 3D measurement-based inspection equipment and solutions provider, performs an essential role for quality control and process optimization across a growing set of industries including printed circuit board assembly, machining and assembly process manufacturing, semiconductor manufacturing, and various medical fields. In addition to corporate headquarters in Seoul, Korea, Koh Young has established sales and support offices in Germany, Japan, Singapore, China, and the United States. The local facilities ensure Koh Young maintains close communication and support with our customers, while providing a global network to support its customers.
Share on:
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.