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Seika Machinery to Showcase Latest Solder Paste Mixer at SMTAI 2017
August 25, 2017 | Seika Machinery, Inc.Estimated reading time: Less than a minute
Seika Machinery Inc. will show the new Malcom SPS-2000 Solder Paste Mixer at SMTA International. This new version adds may new functions to make sure your paste is at its optimum condition for use.
The SPS-2000 features high-speed mixing capabilities (approx. 1000RPM), resulting in shorter mixing times. The mixer can be programmed to automatically stop at a specified mixing time or paste temperature. The system’s temperature monitoring function allows the user to verify the paste's optimum temperature.
The SPS-2000 cam program and run up to eight user-specified mixing profiles. Programs are created via connecting a PC and using the software. The built-in auto balancer function automatically counter balances a single paste jar according to the amount of paste present in the jar. The jar does not have to be full.
For more information, visit Seika Machinery in Booth #715 at SMTA International, scheduled to take place Sept. 19-20, 2017 at the Donald Stephens Convention Center in Rosemont, Illinois.
About Seika Machinery, Inc.
Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services. For more information click here.
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Brent Fischthal - Koh YoungSuggested Items
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Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.