-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
KYZEN's Dr. Mike Bixenman Co-Authors Three Papers for SMTAI 2017
August 29, 2017 | KyzenEstimated reading time: 2 minutes

KYZEN CTO Dr. Mike Bixenman has co-authored three papers that will be presented during the technical conference at SMTA International 2017. The SMTA International Technical Conference is scheduled to take place September 17-21, 2017 at the Donald E. Stephens Convention Center in Rosemont, Illinois.
The presentation entitled "Cleanliness Process Control – An Innovative Approach to a Complex Problem," and co-authored by Mark McMeen and Jason Tynes, STI Corporation, and David Lober, KYZEN, is scheduled to take place during the Spotlight 4 session on Process Control. Mark McMeen will be presenting.
Surface Insulation Resistance (SIR) testing has commonly been performed by electronics testing labs on industry specific test boards. With the adoption of bottom terminated components, there has been a void for a process control method at the assembly site for measuring electro-chemical reliability. The purpose of this research is to development and validate an SIR process control method that can be implemented at the assembly site.
The presentation entitled “Dendritic Growth from Chemical Contamination and Partial Cleaning: Fundamental Tests and Application Study,” and co-authored by Bruno Tolla, Ph.D., Denis Jean, Jennifer Allen & Kyle Loomis, KESTER Corporation, and David Lober, KYZEN, will take place during the Flux, Solder, Adhesives Track on Wednesday, Sept. 20 at 11 a.m. Mike Bixenman will be presenting
The purpose of this study is to analyze at a fundamental level the impact of various chemical residues on dendritic growth and corrosion of conductive traces and to correlate these electrochemical effects with real-life application conditions. For this purpose, a non-standard test board enables the quantification of the dendritic growth kinetics between Y-shaped traces, in function of the chemical residue characteristics and environmental conditions.
The presentation entitled, “Localized Ion Chromatography Method Development and Validation,” co-authored by Mark McMeen and Jason Tynes, STI Corporation, and David Lober, KYZEN, will take place during the Cleaning Session on Thursday, Sept. 21 at 9:00 a.m.
Component specific test boards developed for both localized IC and SIR testing allow for analyzing problematic ions and electrical resistance responses on specific bottom terminated components. The area where the component is placed is routed out on the test board so the specific component can undergo localized testing. The purpose of this research paper is to develop and validate localized IC testing.
Bixenman has more than 20 years of experience in the design of electronic assembly cleaning materials and process integration. He held the position of IPC/SMTA Cleaning Symposium Chair over the last 10 years and is the current chair of the IPC Cleaning Handbook Task Group. Bixenman holds four earned degrees including a Doctorate in Business Administration.
About KYZEN
KYZEN is a global leader in providing environmentally responsible, RoHS compliant precision cleaning chemistries for industries ranging from electronics and advanced packaging to metal finishing and aerospace applications. Since its founding in 1990, KYZEN’s innovative cleaning technologies, scientific expertise and customer support have been repeatedly recognized with the industry’s most prestigious awards. For more information, click here.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Weller Tools Supports Future Talent with Exclusive Donation to SMTA Michigan Student Soldering Competition
07/23/2025 | Weller ToolsWeller Tools, the industry leader in hand soldering solutions, is proud to announce its support of the upcoming SMTA Michigan Expo & Tech Forum by donating a limited-edition 80th Anniversary Black Soldering Set to the event’s student soldering competition.
Koh Young Appoints Tom Hattori as President of Koh Young Japan
07/21/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, announced the appointment of Tom Hattori as President of Koh Young Japan (JKY).
Silicon Mountain Contract Services Enhances SMT Capabilities with New HELLER Reflow Oven
07/17/2025 | Silicon Mountain Contract ServicesSilicon Mountain Contract Services, a leading provider of custom electronics manufacturing solutions, is proud to announce a significant upgrade to its SMT production capability with the addition of a HELLER 2043 MK5 10‑zone reflow oven to its Nampa facility.
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
SHENMAO Strengthens Semiconductor Capabilities with Acquisition of PMTC
07/10/2025 | SHENMAOSHENMAO America, Inc. has announced the acquisition of Profound Material Technology Co., Ltd. (PMTC), a premier Taiwan-based manufacturer of high-performance solder balls for semiconductor packaging.