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iNEMI to Hold Roadmap Webinar on Packaging and Component Substrates
August 29, 2017 | iNEMIEstimated reading time: Less than a minute
New architectures and platforms are emerging to populate cloud infrastructures. Because of this, packaging technologies will be required to provide higher performance, lower power, increased physical density of bandwidth and decreased latency — all at no increase in cost.
The 2017 iNEMI Roadmap chapter on packaging and component substrates is intended to provide focus and direction to industry, academia and government on critical technology trends and motivations for research needed to meet next-generation packaging requirements.
The webinar will be held on August 30, 2017, and will be presented by Bill Bottoms (3MTS), Chair, Packaging & Component Substrates TWG, 2017 iNEMI Roadmap.
For more information or to register, click here.
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Sweeney Ng - CEE PCBSuggested Items
From Factory Floor to ‘The Component Store’
07/25/2025 | Marcy LaRont, I-Connect007Daniel Beauvois began his career in PCB manufacturing 15 years ago with zero industry experience—just a willingness to learn. Daniel immersed himself in every step of circuit board production, from hanging out on the factory floor to giving plant tours. Now, as founder of The Component Store, he’s an independent sales rep known for integrity, persistence, and deep technical knowledge. In this interview, Daniel reflects on his journey, the realities of being an outside rep, and what it takes to earn—and keep—a customer’s trust in an ever-evolving electronics industry.
Flip Electronics Unifies Manufacturing Operations Under New Flip Manufacturing Services Brand
07/22/2025 | PRNewswireFlip Electronics, an authorized distributor of obsolete semiconductors and electronic components, announced that it is rebranding its subsidiary, Resurgent Manufacturing Services, to Flip Electronics Manufacturing Services (FMS).
Designers Notebook: Basic PCB Planning Criteria—Establishing Design Constraints
07/22/2025 | Vern Solberg -- Column: Designer's NotebookPrinted circuit board development flows more smoothly when all critical issues are predefined and understood from the start. As a basic planning strategy, the designer must first consider the product performance criteria, then determine the specific industry standards or specifications that the product must meet. Planning also includes a review of all significant issues that may affect the product’s manufacture, performance, reliability, overall quality, and safety.
HyRel Technologies, NJ MET Announce Strategic Collaboration for Integrated Component Services
07/16/2025 | HyRelThe collaboration brings together two trusted names in the electronics industry, uniting over 75 years of combined expertise to offer a more complete solution for customers seeking fast, reliable, and cost-effective services.
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.