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In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
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iNEMI to Hold Roadmap Webinar on Packaging and Component Substrates
August 29, 2017 | iNEMIEstimated reading time: Less than a minute
New architectures and platforms are emerging to populate cloud infrastructures. Because of this, packaging technologies will be required to provide higher performance, lower power, increased physical density of bandwidth and decreased latency — all at no increase in cost.
The 2017 iNEMI Roadmap chapter on packaging and component substrates is intended to provide focus and direction to industry, academia and government on critical technology trends and motivations for research needed to meet next-generation packaging requirements.
The webinar will be held on August 30, 2017, and will be presented by Bill Bottoms (3MTS), Chair, Packaging & Component Substrates TWG, 2017 iNEMI Roadmap.
For more information or to register, click here.
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Micross, Sital Announce Global Manufacturing & Distribution Partnership
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