SMT Perspectives and Prospects: Warren Buffett’s Perpetual Wisdom, Part 1
Standard of Excellence: Training Your Team to Excel in Customer Service
Smart Automation: What Industry 4.0 Means for Mid-sized Electronics Manufacturing
International Wafer-Level Packaging Conference (IWLPC) Workshops
August 29, 2017 | IWLPCEstimated reading time: 1 minute
The SMTA and Chip Scale Review are pleased to announce the Workshops for the 14th Annual International Wafer-Level Packaging Conference (IWLPC) held October 26th. IWLPC will be held October 24-26, 2017 at the DoubleTree Airport Hotel in San Jose, California.
Two workshops are scheduled for the morning of October 26th. John Hunt, ASE (US) Inc., will instruct “Fan-Out Packaging – Technology Overview and Evolution,” providing an overview of the drivers, technology, advantages and disadvantages of various structural and processing options, as well as a view of potential future trends for Fan-Out Packaging.
Concurrently, Fernando Roa, Ph.D., Amkor Technology, will lead the course “Package on Package, Design, Process and Quality,” delving into critical design rules to observe during the layout of the substrates required for such packaging as well as best known methods for assembly including rules of thumb for selection of materials, typical process flows, and quality metrics.
Two workshops are also slated for the afternoon. John Lau, Ph.D., ASM Pacific Technology, will discuss recent advances in fan-out wafer/panel level packaging, 3D IC packaging, 3D IC integration, 2.5D IC Integration, embedded 3D hybrid integration, 3D CIS/IC integration, 3D MEMS/IC integration, and Cu-Cu hybrid bonding in his workshop “Fan-Out Wafer-Level Packaging and 3D Packaging.”
That same afternoon, Rao R. Tummala, Ph.D., Georgia Institute of Technology, will instruct “Future of Packaging: Embedded and Non-embedded and Fan-Out.” The course will review the current approach to devices, device packaging and system packaging including traditional single- and multi-chip packaging as well as the recent focus in embedded and fan-out packaging.
For more information, click here.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Microchip Enters into Partnership Agreement with Delta Electronics on Silicon Carbide Solutions
07/18/2025 | Globe NewswireThe growth of artificial intelligence (AI) and the electrification of everything are driving an ever-increasing demand for higher levels of power efficiency and reliability.
ViTrox’s HITS 5.0 Empowers Global Partners with Innovative Solutions and Stronger Bonds
07/16/2025 | ViTroxViTrox, strives to be the World’s Most Trusted Technology Company, proudly announces the successful conclusion of its fifth edition of High Impact Training for Sales (HITS 5.0), held from 23rd to 27th June 2025 at ViTrox Campus 2.0 and 3.0, located in Batu Kawan Industrial Park, Penang, Malaysia.
Global Citizenship: The Global Push for Digital Inclusion
07/16/2025 | Tom Yang -- Column: Global CitizenshipIt can be too easy to take the technology at our fingertips for granted: high-speed internet, cloud-based collaboration, and instant video calls across continents. Yet, for billions of people, access to these digital tools is a distant dream. As a global community, we must ensure that technology is available to all. Here is how technology is bridging physical, economic, and educational gaps in underserved regions and profoundly reshaping lives.
Microchip Expands Space-Qualified FPGA Portfolio with New RT PolarFire® Device Qualifications and SoC Availability
07/10/2025 | MicrochipContinuing to support the evolving needs of space system developers, Microchip Technology has announced two new milestones for its Radiation-Tolerant (RT) PolarFire® technology: MIL-STD-883 Class B and QML Class Q qualification of the RT PolarFire RTPF500ZT FPGA and availability of engineering samples for the RT PolarFire System-on-Chip (SoC) FPGA.
Infineon Advances on 300-millimeter GaN Manufacturing Roadmap as Leading Integrated Device Manufacturer (IDM)
07/10/2025 | InfineonAs the demand for gallium nitride (GaN) semiconductors continues to grow, Infineon Technologies AG is poised to capitalize on this trend and solidify its position as a leading Integrated Device Manufacturer (IDM) in the GaN market.