The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
Vern Solberg to Conduct Tutorial Workshop at SMTAI
August 30, 2017 | Vern SolbergEstimated reading time: Less than a minute
Independent consultant Vern Solberg will conduct a half-day tutorial workshop, “Flex and Rigid-Flex Circuits: Design and Assembly Process Principles,” during SMTA International 2017. The tutorial program will be held at the SMTA International Conference in Rosemont, Illinois, on Sunday, September 17.
This tutorial workshop has been developed to furnish design professionals, systems engineers, and assembly and test engineering specialists with a thorough understanding of the materials, fabrication process variations and preferred design practices for flexible and rigid-flex circuits. In addition, the requirements for automated SMT assembly will be defined and will include detailed discussion regarding panel planning and assembly process variations.
IPC standards for flex and rigid-flex dielectrics will be presented along with basic essentials for circuit fabrication, material metallization technologies selection criteria for SMT components and principles for SMT land pattern development. Assembly processing of flex and rigid-flex circuits will also be detailed with focus on dimensioning and tolerance criteria of palletized layout for in-line assembly processing, SMT assembly process methodologies and alternative joining methods for flexible circuits.
To register for this timely tutorial workshop program, click here.
Share on:
Suggested Items
Robosys, ACUA Ocean + OREC Secure Funding For Collaborative Autonomy Project
12/25/2024 | RobosysAdvanced maritime autonomy developer, Robosys Automation, supported by USV manufacturer, ACUA Ocean, and Offshore Renewable Energy Catapult (OREC), have jointly secured grant funding through Innovate UK.
IPC Announces New Training Course: PCB Design for Military & Aerospace Applications
12/23/2024 | IPCIPC announced the launch of a new training course: PCB Design for Military & Aerospace Applications.
Spotlight on PEDC: Filbert Arzola
12/19/2024 | Andy Shaughnessy, Design007 MagazineIPC and FED have teamed up to create a new PCB design conference in Vienna, Austria. The Pan-European Electronics Design Conference (PEDC) takes place Jan. 29-30 at the NH Danube City hotel in Vienna. Raytheon’s Filbert Arzola is presenting “Engineering and Adapting Model-based PCB Design in Step with Sustainability and Digital Twins” at PEDC. I asked Filbert to discuss what attendees can expect from his class.
Avnet Insights: Engineers Outline Opportunity for AI
12/19/2024 | AvnetFor the fourth consecutive year, Avnet, Inc. (Nasdaq: AVT) will release its Avnet Insights survey, which has been keeping a pulse on how engineers are responding to the market since 2021. This year’s survey examines technology’s new frontier: Artificial Intelligence, and the promise – and challenges – it presents for product design.
IPC/WHMA Launches Groundbreaking Online Course on Wire Harness Design
12/18/2024 | IPCIPC/WHMA is excited to announce the launch of its new online instructor-led training course, "Introduction to Wire Harness Design I," available now through the IPC EDGE Learning Management System.