Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Vern Solberg to Conduct Tutorial Workshop at SMTAI
August 30, 2017 | Vern SolbergEstimated reading time: Less than a minute
Independent consultant Vern Solberg will conduct a half-day tutorial workshop, “Flex and Rigid-Flex Circuits: Design and Assembly Process Principles,” during SMTA International 2017. The tutorial program will be held at the SMTA International Conference in Rosemont, Illinois, on Sunday, September 17.
This tutorial workshop has been developed to furnish design professionals, systems engineers, and assembly and test engineering specialists with a thorough understanding of the materials, fabrication process variations and preferred design practices for flexible and rigid-flex circuits. In addition, the requirements for automated SMT assembly will be defined and will include detailed discussion regarding panel planning and assembly process variations.
IPC standards for flex and rigid-flex dielectrics will be presented along with basic essentials for circuit fabrication, material metallization technologies selection criteria for SMT components and principles for SMT land pattern development. Assembly processing of flex and rigid-flex circuits will also be detailed with focus on dimensioning and tolerance criteria of palletized layout for in-line assembly processing, SMT assembly process methodologies and alternative joining methods for flexible circuits.
To register for this timely tutorial workshop program, click here.
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Peters, Starteam, and Würth Elektronik Team Up For Digital Coating Technology
10/23/2025 | PetersUnder this heading, the PCB manufacturers Starteam and Würth Elektronik, along with Peters as inkjet coating supplier, have taken the initiative and worked together for months in trusting and target-oriented cooperation, to promote this innovative digital coating technology for solder resists and establish it on the market.
AI Triggers Next Paradigm Shift in PDN
10/23/2025 | Istvan Novak, SamtecArtificial intelligence (AI), together with machine learning (ML), is creating an unprecedented surge of computing and networking infrastructure needs. This, in turn, has dramatically increased the power consumption of computing and networking chips.
SEMICON Japan 2025 to Spotlight Sustainability in AI and Semiconductor Innovation
10/22/2025 | SEMISEMICON Japan 2025, the largest gathering of leaders from the microelectronics manufacturing supply chain in Japan, will bring together more than 1,200 exhibitors showcasing semiconductor solutions from December 17-19 at Tokyo Big Sight.
Zuken Announces ZIW Americas 2026 in Dallas
10/21/2025 | ZukenZuken USA, Inc., a global leader in electrical and electronic design automation, announced Zuken Innovation World (ZIW) Americas 2026, the company’s premier global conference dedicated to advancing the future of electrical and electronic product design. ZIW 2026 will be held June 9-11 in Dallas, Texas.
Keysight Completes Acquisition of Synopsys’ Optical Solutions Group and Ansys’ PowerArtist
10/17/2025 | Keysight Technologies, Inc.Keysight Technologies, Inc., announced the completion of its acquisitions of the Optical Solutions Group from Synopsys, Inc., and PowerArtist from Ansys, Inc.