-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueDon’t Just Survive, Thrive
If we are to be relevant and prosper during these next critical decades in electronics, we must do more than survive. As an industry, we can and must thrive. In this issue, our contributors explore these concepts meant to help you take your business to the next level.
Material Matters
Materials management is nuanced, multifaceted, and requires a holistic systems approach for business success. When building high mix, low volume, and high technology, managing materials and overall cost containment are even greater challenges.
Additive Manufacturing
In this month’s issue, we explore additive manufacturing technology for the PCB fabricator: where it stands today, the true benefits, and where it seems to be headed.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
AT&S Enables "Cool" Designs for Miniaturized High-Power Applications
August 30, 2017 | AT&SEstimated reading time: 4 minutes
Miniaturization and increasing power densities are major concerns for modern electronic applications. The lifetime of electronic applications can be dramatically reduced by the increase of the working temperatures by just a few degrees. Further, the insulation of the whole printed circuit board (PCB) from the environment in order to provide efficient protection against humidity and dust for certain applications turns heat dissipation an even more challenging task.
State-of-the-art thermal management in the PCB is done by basically adding more copper to the PCB structure with constructions such as thick copper layers, Plated Through Holes (PTHs), copper filled laser vias or even copper inlays. Such methods can provide good heat dissipation, but can be also related to some disadvantages for several reasons: in the special case of thick copper planes for heat spreading, the production of the PCB becomes more costly and difficult since new equipment to handle the heavy thick copper panels is required. Besides, high-density packaging requires extreme fine copper lines in the PCB circuitry. This is not easily achieved when thick layers of copper are to be etched. In addition, weight is a major concern for aerospace applications and has become more attention for modern automotive concepts such as e-vehicles. Beyond that, large amounts of copper for cooling purposes can become very expensive. Thermal solutions such as modern miniaturized heat pipes which are light, have superior thermal conductive properties than copper and have sizes that are compatible with PCB dimensions can address thermal management challenges in modern high-end applications.
Heat pipes, due to their superior heat transfer capability with relatively small amount of mass, can guide heat very efficiently throughout the PCB plane. Modern heat pipes are small enough to be incorporated to PCB constructions. Their thickness can range from about 400 µm up to 2 mm. AT&S uses its know- how in embedding components and in 2.5D technology in order to associate mini heat pipes with the PCB. The application of heat pipes directly in the PCB body allows new design freedom such as remote cooling, heat guiding and heat spreading. For example, heat guiding may open room for the implementation of temperature sensitive components such as sensors and MEMS close to heat generating devices such as transistors. Further, the enhanced cooling capabilities of embedded heat pipes PCBs (HP-PCBs) may allow devices to run at lower temperatures which will in turn increase efficiency, lifetime and energy savings to most of electronic applications.
The embedded/inserted heat pipe is a passive component able to transport heat at large distances in the PCB more efficiently than any classical heat conductors (ex.: copper). Its heat transport mechanism is based on phase change (i.e. liquid-gas transformation) and mass transport. The heat pipe is a tubular structure sealed on both ends with an enclosed liquid at very low pressures. Normally, the tube is made of copper and water is the used liquid. When one end of the tube is heated, the water “changes phase” (in simple terms: becomes vapor), the increase of vapor pressure drives the vaporized water to the cold end of the tube. There, the water vapor releases energy and turns again into liquid. Capillary forces drag the liquid water back to the hot end of the tube. This dynamic process is repeated continuously and results in heat-transfer capabilities ranging from 100 to several thousand times that of a piece of copper with equivalent size. Since the heat pipe is a hollow structure, it has the additional advantage of being much lighter than copper rods.
AT&S demonstrated an innovative approach of associating “ready-to-use” mini heat pipes to the PCB body turning it into a complete heat management module. Various PCB demonstrator samples with embedded and inserted heat pipes were manufactured. Different strategies were used to associate miniature heat pipes with the PCB. In all experiments, the HP-PCB concept helped increasing the system’s overall thermal performance in comparison with current technologies. This technology is considered a thermal solution to virtually any electronic application where enhanced heat spreading or heat guiding is required. Potential in applications are specially found where weight and space are restrictive. Examples can be found in aviation, automotive and modern server applications.
AT&S R&D is actively looking for partners who have special challenges regarding thermal solutions for their future products and are willing to test the HP-PCB technology as early adopters. In its vision, modern PCBs must have enhanced functionalities (such as enhanced heat management, embedded components, high frequency materials, material hybridization etc.) which will become part of the solution to any technological challenge future applications might have.
About AT&S
AT&S is the European market leader and one of the globally leading manufacturers of high-value printed circuit boards and IC substrates. AT&S industrialises leading-edge technologies for its core business segments Mobile Devices, Automotive, Industrial, Medical and Advanced Packaging. AT&S has a global presence, with production facilities in Austria (Leoben and Fehring) and plants in India (Nanjangud), China (Shanghai, Chongqing) and Korea (Ansan, near Seoul). The company employed an average of 9,526 people in the financial year 2016/17. For more, click here.
Suggested Items
Trouble in Your Tank: Materials for PWB Fabrication—Drillability and Metallization
07/16/2024 | Michael Carano -- Column: Trouble in Your TankLaminate materials are the building blocks on which printed circuit boards are manufactured. Circuit board designers rely on the critical electrical properties of the materials to design the interconnects, and with the drive toward IoT (internet of things), autonomous driving, and virtual and augmented reality, material properties take on a very high level of importance.
Beyond Prepreg: The Glassless ‘Revolution’
06/25/2024 | Marcy LaRont, PCB007 MagazineAs our industry rallies around the call to action for HDI and UHDI, we find unparalleled and myriad laminate options. This abundance is rivaled only by the question surrounding them: Can they measure up to the high technology packaging demands required in our near future? Unsurprisingly, recent developments in FR-4-esque materials for high-speed and high-density designs, as well as newer, glassless technology for replacing traditional glass-impregnated laminates and prepreg, are garnering much interest. I caught up with Alun Morgan, technology ambassador for Ventec International Group, to ask about the impending “glassless revolution” and how it’s poised to solve some of our manufacturing challenges.
Connect the Dots: Designing for Reality—Lamination and Materials
06/19/2024 | Matt Stevenson -- Column: Connect the DotsAs many of you have likely figured out, I am quite passionate about the subject of designing PCBs for the reality of manufacturing. I wrote a book about it and I participate in an I-Connect007 On the Line with… podcast series dedicated to the subject. This companion article will focus on multilayer lamination, keeping the bigger picture in mind: Realistic PCB designs should prioritize manufacturability and reliability of the PCB as well as meet the other design requirements. So, one must account for the production variables associated with individual manufacturing partners.
Day 2: A Full Day at the EIPC Summer Conference
06/19/2024 | Pete Starkey, I-Connect007Editor's note: This is the third and final report from the EIPC Summer Conference. It was a bright and early start to the second day of the 2024 EIPC Summer Conference at the European Space Centre, Noordwijk, The Netherlands, June 4-5. A short journey by bus from the hotel in Leiden and our security passes from the day before got us through the gate and to our seats in the Newton Room for Session 4, “Material Studies,” moderated by Martyn Gaudion.
Looking Into Space: EIPC Summer Conference, Part 2
06/17/2024 | Pete Starkey, I-Connect007“Innovative Development of PCB Technology and Design” was the theme of the second session of the 2024 EIPC Summer Conference, June 4-5, at the European Space Centre, Noordwijk, The Netherlands.