Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Alpha to Present Leading Edge Products at ER-SA Elektrik Customer Seminar in Turkey
August 30, 2017 | Alpha Assembly SolutionsEstimated reading time: 2 minutes
Alpha Assembly Solutions will be presenting information on its latest product innovations at a seminar hosted by ER-SA Elektrik, Alpha’s distributor partner for Turkey, in Aselsan, Turkey, on September 11, 2017.
Alpha’s latest technology developments including ALPHA Sintering Technology, a range of products designed to meet the demanding quality standards of the power semiconductor and LED industry, will be discussed during the event. Alpha’s Sinter Technology products include ALPHA Argomax which has been specially designed for low pressure sintering die attachment.
“ALPHA Argomax in paste, film and preform technologies, provides high thermal and electrical conductivity silver bonds, high reliability and flexible bondline thickness,” explains Julien Joguet, Global Product Manager for Sintered Materials for Alpha Assembly Solutions, a MacDermid Performance Solutions business. “This addresses issues with die attach reliability in high volume manufacturing and challenging Si/SiC/GaN die attach processes.”
As well as advancements in sintering technologies, Alpha’s latest new cleanable, no-clean material, ALPHA OM-347 solder paste, will be discussed at the seminar. The product has been designed to print and reflow Type 4 and Type 5 powder to meet market segments requiring ultra-fine feature applications. ALPHA OM-347 has been tested to give excellent printing performance and an outstanding reflow process window. After reflow, the resulting residue produced can be safely left on the board, or if needed, it can be very easily cleaned with a broad range of solvents.
About ER-SA Elektrik
ER-SA Elektrik have 12 years’ experience supplying electronic assembly materials across Turkey. The company, which is mainly based in the Istanbul area, has sites throughout the country, including a site in Ankara which opened at the beginning of 2015. This site includes a team of 4 people dedicated to selling Alpha products.
About Alpha Assembly Solutions
Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.
With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA electronics assembly material products, including Solder Paste, Exactalloy Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax, Atrox and Fortibond brands.
For the LED segment, Alpha offers its Lumet products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, click here.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.