Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Cybertronic's MRS Technology in SQ3000 3D AOI Featured at productronica India
August 31, 2017 | CyberOptics CorporationEstimated reading time: 2 minutes
CyberOptics Corporation today announced plans to exhibit at productronica India, scheduled to take place Sept. 14-16, 2017 at the Pragati Maidan in New Delhi. The company will demonstrate the SQ3000 3D Automated Optical Inspection (AOI) system with the new Ultra-High-Resolution Multiple-Reflection Suppression (MRS) Sensor in the Maxim SMT Booth #1130, Hall #11. The company also will showcase its QX250i double-sided AOI and SE500ULTRA high-speed AOI.
The best-in-class SQ3000 3D AOI system maximizes ROI and line utilization with multi-view 3D sensors that capture and transmit data simultaneously and in parallel, accelerating 3D inspection speed versus alternate technology. The proprietary MRS sensor technology with the highly sophisticated 3D fusing algorithms offers microscopic image quality at production speeds.
The new Ultra-High Resolution MRS sensor will be featured on the SQ3000™ 3D AOI. This sensor enhances the SQ3000 3D AOI platform, delivering superior inspection performance, ideally suited for the 0201 metric process and micro-electronic applications where an even greater degree of accuracy and inspection reliability is critical.
Also on display, the QX250i simultaneous double-sided AOI system offers fast, flexible and high performance inspection for all applications, and is ideally suited for pre-reflow and selective solder inspection. The top and bottom high-resolution Strobed Inspection Modules (SIMs) with enhanced illumination provide a single platform for the inspection and defect review process that shortens the production line and drives approximately 50 percent productivity improvement.
The SE500ULTRA system is power-packed with the newly designed V5 series software enabling world-class user experience and optional dual illumination sensor. An all-new, improved ultrafast sensor combined with a unique ‘all-in-one’ scan technique – that integrates fiducial, barcode and range scans into one, seamless scan sequence – makes the SE500ULTRA 30 percent faster at 210cm²/sec. You can choose the Dual Illumination sensor option for best repeatability and reproducibility results – even on the smallest paste deposits.
The SE600 3D SPI system delivers ‘true’ volume measurement and world-class usability. Designed with a state-of-the-art dual illumination sensor, it offers the best repeatability and reproducibility – even on the smallest paste deposits. The award-winning software offers full touch screen capability and world-class user experience for easy, flawless inspection.
About CyberOptics
CyberOptics Corporation (NASDAQ: CYBE) is a leading global developer and manufacturer of high precision sensing technology solutions. CyberOptics sensors are being used in general purpose metrology and 3D scanning, surface mount technology (SMT) and semiconductor markets to significantly improve yields and productivity. By leveraging its leading edge technologies, the company has strategically established itself as a global leader in high precision 3D sensors, allowing CyberOptics to further increase its penetration of its key vertical markets. Headquartered in Minneapolis, Minnesota, CyberOptics conducts worldwide operations through its facilities in North America, Asia and Europe.
For more information, click here.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.