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Advanced Electronics Packaging Digest

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Foxconn's Kathy Yang Honored In Most Powerful Women Asia 2026 By Fortune

10/12/2026 | Foxconn
Reflecting responsibilities that sit at the intersection of the physical industrial world and the AI world for the largest electronics manufacturer and AI server provider on the planet, Kathy Yang of Hon Hai Technology Group (Foxconn) has been recognized in Most Powerful Women Asia 2026 by Fortune, for a second year.

TTM Technologies Plans $400M AI Infrastructure Investments in China and Malaysia

10/12/2026 | Globe Newswire
This expansion initiative represents incremental investments to the previously disclosed commitment to invest $1.2 billion through the 2025-2029 timeframe and is buttressed by ongoing discussions with our long-standing customer partners indicating expected demand increases.

Global Electronics Association, Purdue University Establish Strategic Partnership to Advance Electronics Innovation

10/09/2026 | Global Electronics Association
The Global Electronics Association and Purdue University have signed a memorandum of understanding establishing a strategic partnership to advance innovation, workforce development and industry collaboration across the electronics ecosystem.

Six Suppliers Bet on VCSEL NPO as Demand Hits 650 Million Units by 2031

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TrendForce’s latest report, “2027 Infrared Sensing and Optical Communication Market Trend”, shows that rapidly growing demand for data transmission in expanding data center networks is increasing interest in VCSEL-based near-packaged optics (NPO).

Chiplytics Raises $4.5M to Strengthen US Electronics Supply Chain

10/08/2026 | BUSINESS WIRE
Chiplytics, a pioneer in microelectronics verification technology, announced a $4.5 million funding round led by Scout Ventures and Waypoint Ventures and the opening of an inspection laboratory in Bellport, New York.
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