Deca Announces Agreement with IBM to Bring High-Density Fan-Out Interposer Production to North America
May 20, 2025 | Deca TechnologiesEstimated reading time: 1 minute

Deca Technologies announced the signing of an agreement with IBM to implement Deca’s M-Series™ and Adaptive Patterning® technologies in IBM’s advanced packaging facility in Bromont, Quebec. Through the agreement, IBM will implement a high-volume manufacturing line with a focus on Deca’s M-Series Fan-out Interposer Technology (MFIT™).
This collaboration builds on IBM’s strategy to develop its advanced packaging capabilities. IBM Canada's plant in Bromont is one of North America’s largest semiconductor assembly and test sites and has been at the forefront of packaging innovation for over five decades. Recent investments to expand the site’s capabilities have positioned it as a critical hub for high-performance packaging and chiplet integration, supporting technologies like MFIT that are essential for AI, HPC, and data center applications.
Deca’s M-Series platform is the highest-volume fan-out packaging technology in the world, with over seven billion M-Series units shipped. MFIT builds on this proven foundation by integrating embedded bridge die for chips’ last processor and memory integration delivering high-density, low-latency connections between chiplets. MFIT provides a cost-effective alternative to full silicon interposers, offering improved signal integrity, greater design flexibility, and the scalable format needed for ever-larger AI, HPC, and data center devices.
This cooperation reflects the shared commitment of IBM and Deca to advance the next generation of semiconductor packaging. By combining IBM’s advanced packaging capabilities with Deca’s proven technology, the two companies are expanding the global supply chain for the future of high-performance chiplet integration and advanced computing systems.
“Advanced packaging and chiplet technology are critical for faster, more efficient computing solutions in the age of AI. Deca will help ensure IBM’s Bromont facility remains at the forefront of these innovations, strengthening our commitment to helping our clients bring products to market faster and deliver better performance for AI and data-heavy applications,” said Scott Sikorski, Head of Business Development for Chiplets & Advanced Packaging at IBM.
“IBM’s rich history in semiconductor innovation and advanced packaging makes them an ideal partner to bring MFIT to high-volume production,” said Tim Olson, Founder and CEO of Deca. “We are thrilled to be working together to bring this advanced interposer technology to the North American ecosystem.”
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
TI DLP® Technology Delivers High-Precision Digital Lithography for Advanced Packaging
10/02/2025 | Texas InstrumentsTexas Instruments is enhancing the next generation of digital lithography with the introduction of the DLP991UUV digital micromirror device (DMD), the company’s highest resolution direct imaging solution to date.
Now Available—The Companion Guide to… SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages
10/01/2025 | I-Connect007I-Connect007 is pleased to announce the release of an 18-page resource for engineers, technologists, and decision-makers in electronics manufacturing: The Companion Guide to SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages.
Highlights from the IMAPS Onshoring Advanced Packaging Workshop in Washington, D.C.
09/30/2025 | Marcy LaRont, I-Connect007IMAPS and the Global Electronics Association co-hosted the Onshoring Advanced Packaging and Assembly Workshop in Washington, D.C., in early September. Government leaders, including those from the Department of Defense, attended and were directly involved in organizing the content of the sessions. Jim Will, director of the U.S. Partnership for Assured Electronics, speaks about his role in the event.
SCHMID Advances Next-Gen Advanced Packaging with New InfinityLine and Glass Core Substrate Solutions
09/29/2025 | SCHMID GroupSCHMID Group, a leading global provider of equipment and solutions for the electronics industry, announces a major expansion of its product portfolio to meet the surging demand for two types of products: Advanced packaging substrates and high-performance server boards, in the era of Artificial Intelligence (AI).
Siemens, ASE Collaborate on Workflows for ASE’s VIPack Advanced Packaging Platform
09/25/2025 | SiemensSiemens Digital Industries Software announced that it is collaborating with Advanced Semiconductor Engineering, Inc. (ASE), the leading global provider of semiconductor manufacturing services in assembly and test, to develop 3Dblox-based workflows for the ASE VIPack™ platform using Siemens’ Innovator3D IC™ solution, which is fully certified for the 3Dblox standard..